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MC14468P

NXP Semiconductors

MC14468P by NXP Semiconductors

ANALOG CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,086 parts In-Stock

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4,086

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Digiode

USA . 2,650 parts In-Stock

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2,650

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Anansix

USA . 1,327 parts In-Stock

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1,327

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Distributors (Availability)

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One Stop Electronics

USA . 1,858 parts In-Stock

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$3.500

100+ parts

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1,858

$3.500

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Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$3.633

100+ parts

$3.597

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$3.452

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100

$3.633

$3.597

$3.452

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QUARKTWIN TECHNOLOGY LTD

USA . 24,980 parts In-Stock

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24,980

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Kepictronics

USA . 4,001 parts In-Stock

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4,001

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Microchip USA

USA . 2,906 parts In-Stock

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2,906

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UNI Independent Distributors

Spain . 1,014 parts In-Stock

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1,014

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Corphita

USA . 484 parts In-Stock

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484

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Metaverse IC Inc.

Canada . 350 parts In-Stock

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350

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Assy Fe

Spain . 110 parts In-Stock

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Technical Specifications

Other Function Semiconductors MC14468P attributes and parameters. Explore more Other Function Semiconductors devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDIP-T16

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

6 V

Nominal Supply Voltage (Vsup):

9 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Trade Compliance

MC14468P Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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