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MC145010P

NXP Semiconductors

MC145010P by NXP Semiconductors

ANALOG CIRCUIT; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;

Median Price

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Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Vyrian

USA . 3,646 parts In-Stock

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Anansix

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Speed Components Ltd

Israel . 2,150 parts In-Stock

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Digiode

USA . 1,872 parts In-Stock

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First Choice Components Inc.

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ECAB

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R&J Components

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Q Components

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Fibra_Brandt Electronic GMBH

Germany . 3 parts In-Stock

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Microchip USA

USA . 228 parts In-Stock

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One Stop Electronics

USA . 1,769 parts In-Stock

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GreenTree Electronics

Israel . 21,000 parts In-Stock

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UNI Independent Distributors

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Corphita

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

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Perfect Parts

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Futuretech Components

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Assy Fe

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Technical Specifications

Other Function Semiconductors MC145010P attributes and parameters. Explore more Other Function Semiconductors devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDIP-T16

Length:

19.2 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

220

Maximum Seated Height:

4.44 mm

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

6 V

Nominal Supply Voltage (Vsup):

9 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7.62 mm

Trade Compliance

MC145010P Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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