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LPC2478FBD208,551

NXP Semiconductors

LPC2478FBD208,551 by NXP Semiconductors

LPC2478FBD208,551 by NXP Semiconductors is a 32-bit ARM7 microcontroller with 24-bit address bus width and 32-bit external data bus width. It operates at a max clock frequency of 25 MHz and has 160 I/O lines, making it ideal for industrial applications requiring high-speed processing and extensive I/O capabilities.

Median Price

$16.011

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 180 parts In-Stock

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-

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$13.832

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$12.951

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180

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$13.832

$12.951

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Rochester

USA . 55 parts In-Stock

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$18.190

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$16.280

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$15.320

55

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$15.320

Flip Electronics (Authorized)

USA . 36 parts In-Stock

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Nova Conductors

Japan . 79 parts In-Stock

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$15.319

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$15.319

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Digiode

USA . 4,724 parts In-Stock

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$19.209

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Vyrian

USA . 9,752 parts In-Stock

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Anansix

USA . 2,741 parts In-Stock

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Flip Electronics

USA . 1,800 parts In-Stock

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Classic Components Corporation

USA . 9 parts In-Stock

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A&K Electronics

USA . 1 parts In-Stock

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Rotakorn

Sweden . 1 parts In-Stock

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Bristol Electronics

USA . 1 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 544 parts In-Stock

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$14.885

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544

$14.885

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Continental Prestige Electronics

USA . 5,424 parts In-Stock

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$15.319

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$15.013

5,424

$15.319

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$15.013

Advanced Electronics

New Zealand . 243 parts In-Stock

1+ parts

$15.779

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$14.990

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$14.990

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243

$15.779

$14.990

$14.990

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Semicontronic

India . 132 parts In-Stock

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$16.510

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$16.097

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$16.015

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132

$16.510

$16.097

$16.015

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Ampacity Inc.

Singapore . 44 parts In-Stock

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$16.510

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44

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Corphita

USA . 4,507 parts In-Stock

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$18.198

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$18.198

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Aztec Data Supply Inc.

USA . 1,905 parts In-Stock

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$49.690

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Perfect Parts

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S.R.D Solutions

India . 23,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 16,030 parts In-Stock

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Lixinc

USA . 9,868 parts In-Stock

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Kepictronics

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Argo Parts USA

USA . 4,579 parts In-Stock

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Microchip USA

USA . 2,462 parts In-Stock

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Corohmni

South Africa . 1,415 parts In-Stock

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UNI Independent Distributors

Spain . 1,135 parts In-Stock

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Infinite Electronics LLP (Excess)

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

Germany . 980 parts In-Stock

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980

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Robosynatics

Brazil . 350 parts In-Stock

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350

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GreenTree Electronics

Israel . 215 parts In-Stock

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Lucentia Tech

USA . 200 parts In-Stock

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Bastille Electronics

Australia . 40 parts In-Stock

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Overview

Unlock the power of innovation with the LPC2478FBD208,551 by NXP Semiconductors. This cutting-edge microcontroller is designed to deliver top-notch performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this product offers unmatched value and benefits to customers looking for seamless integration, advanced features, and enhanced functionality. Trust in NXP Semiconductors' expertise and quality to take your projects to the next level with the LPC2478FBD208,551.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for various environments.

Maximum Supply Voltage: 3.6 V

Supports a higher voltage input range, allowing for flexibility in power supply options.

ADC Channels: YES

Allows the microcontroller to perform analog-to-digital conversion, enabling it to interface with analog sensors or signals.

ROM Words: 524288

Large ROM capacity allows for storing a significant amount of program data or firmware, supporting complex applications.

CPU Family: ARM7

Utilizes the efficient ARM7 architecture, known for its performance and power efficiency, making it a reliable choice for various applications.

Technical Specifications

Microcontrollers LPC2478FBD208,551 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G208

JESD-609 Code:

e3

Length:

28 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

160

No. of Terminals:

208

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP208,1.2SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

100352

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

28 mm

Peripheral IC Type:

Trade Compliance

LPC2478FBD208,551 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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