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LPC2468FBD208,551

NXP Semiconductors

LPC2468FBD208,551 by NXP Semiconductors

NXP Semiconductors' LPC2468FBD208,551 is a 32-bit ARM7 microcontroller with 24-bit address bus and 32-bit external data bus. It features 4 timers, CAN and I2C connectivity, and operates at up to 25 MHz. Ideal for industrial applications requiring low power consumption and high-speed processing.

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Nova Conductors

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Technoshack Inc.

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AZTECH Wire

Italy . 795 parts In-Stock

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One Stop Electronics

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Microchip USA

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Semicontronic

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Aztec Data Supply Inc.

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Corohmni

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Overview

Unleash the power of cutting-edge technology with the LPC2468FBD208,551 by NXP Semiconductors. As a leader in microcontroller innovation, NXP delivers unmatched quality and reliability. Perfect for a wide range of applications, this microcontroller offers unparalleled performance and efficiency. Experience seamless connectivity and advanced features, all while benefiting from the value and advantages that NXP products bring to your projects. Upgrade your designs with the LPC2468FBD208,551 and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components of the microcontroller.

Maximum Supply Voltage: 3.6 V

Allows for robust power supply options and compatibility.

Bit Size: 32

Offers a large data processing capability for complex applications.

ADC Channels: YES

Enables analog to digital conversion for interfacing with sensors and other analog devices.

Peripherals: BOD, DMA, SDMMC, PWM(2), TIMER(4), WDT

Includes a variety of peripherals for enhanced functionality and connectivity.

Connectivity: CAN(2), I2C(3), I2S, SSP(2), UART(4)

Supports multiple communication protocols for versatile connectivity options.

Low Power Mode: YES

Allows for energy-efficient operation to conserve power in battery-powered applications.

Technical Specifications

Microcontrollers LPC2468FBD208,551 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

Boundary Scan:

YES

CPU Family:

ARM7

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G208

JESD-609 Code:

e3

Length:

28 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

1

No. of External Interrupts:

4

No. of I/O Lines:

160

No. of Serial I/Os:

4

No. of Terminals:

208

No. of Timers:

4

On Chip Data RAM Width:

32

On Chip Program ROM Width:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP208,1.2SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

65536

RAM Words:

16384

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

28 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(3), I2S, SSP(2), UART(4)

Peripherals:

BOD, DMA, SDMMC, PWM(2), TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Digital To Analog Convertors:

1-Ch 10-Bit

Trade Compliance

LPC2468FBD208,551 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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