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LPC2460FBD208,551

NXP Semiconductors

LPC2460FBD208,551 by NXP Semiconductors

NXP Semiconductors' LPC2460FBD208,551 is a 32-bit ARM7 microcontroller with 24-bit address bus width and 32-bit external data bus width. It operates at a max clock frequency of 24 MHz and has 160 I/O lines, making it suitable for industrial applications requiring high-speed processing and extensive input/output capabilities.

Median Price

$11.393

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 9,972 parts In-Stock

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$11.616

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9,972

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$11.616

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Flip Electronics (Authorized)

USA . 180 parts In-Stock

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180

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Rochester

USA . 148 parts In-Stock

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$11.170

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$10.000

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$9.410

148

-

$11.170

$10.000

$9.410

Distributors (In-Stock)

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Digiode

USA . 4,471 parts In-Stock

1+ parts

$10.726

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4,471

$10.726

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Vyrian

USA . 5,497 parts In-Stock

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5,497

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Flip Electronics

USA . 4,464 parts In-Stock

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4,464

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Anansix

USA . 703 parts In-Stock

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703

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Nova Conductors

Japan . 100 parts In-Stock

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100

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A&K Electronics

USA . 3 parts In-Stock

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3

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Bristol Electronics

USA . 3 parts In-Stock

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3

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Distributors (Availability)

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Ampacity Inc.

Singapore . 164 parts In-Stock

1+ parts

$9.600

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164

$9.600

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Semicontronic

India . 164 parts In-Stock

1+ parts

$9.600

100+ parts

$9.360

1k+ parts

$9.312

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164

$9.600

$9.360

$9.312

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Corphita

USA . 1,154 parts In-Stock

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$10.161

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1,154

$10.161

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AZTECH Wire

Italy . 764 parts In-Stock

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$12.170

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764

$12.170

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Vigor

Singapore . 118 parts In-Stock

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$17.000

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118

$17.000

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Corohmni

South Africa . 208 parts In-Stock

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$17.154

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208

$17.154

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Microchip USA

USA . 1,230 parts In-Stock

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$46.139

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$46.139

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Argo Parts USA

USA . 3,358 parts In-Stock

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Continental Prestige Electronics

USA . 2,923 parts In-Stock

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2,923

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UNI Independent Distributors

Spain . 2,097 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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2,000

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Speed Components Ltd (Excess)

Israel . 89 parts In-Stock

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89

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Overview

Unleash the power of innovation with the LPC2460FBD208,551 by NXP Semiconductors. Designed with precision and expertise, this microcontroller offers unparalleled performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this cutting-edge technology provides seamless integration and advanced functionality. Elevate your projects with the LPC2460FBD208,551 and experience the quality and value that only NXP Semiconductors can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the microcontroller, ensuring a longer lifespan.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options, accommodating a range of voltage inputs.

Address Bus Width: 24

Enables the microcontroller to access a large memory space, ideal for handling complex calculations and data processing.

Bit Size: 32

Offers high computational power and efficiency, suitable for handling advanced tasks and operations.

DAC Channels: YES

Allows for analog output capabilities, making the microcontroller versatile for interfacing with various sensors and actuators.

CPU Family: ARM7

Utilizes an efficient and widely-used processor architecture, ensuring compatibility with a wide range of software and tools.

RAM Bytes: 100352

Provides a large amount of memory for storing variables and data during program execution, enabling the microcontroller to handle complex algorithms.

Technical Specifications

Microcontrollers LPC2460FBD208,551 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

24 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G208

JESD-609 Code:

e3

Length:

28 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

160

No. of Terminals:

208

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP208,1.2SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

100352

ROM Programmability:

MROM

Maximum Seated Height:

1.6 mm

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

28 mm

Peripheral IC Type:

Trade Compliance

LPC2460FBD208,551 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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