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LPC2458FET180,551

NXP Semiconductors

LPC2458FET180,551 by NXP Semiconductors

LPC2458FET180,551 by NXP Semiconductors is a 32-bit ARM7 microcontroller with 20-bit address bus width and 136 I/O lines. It operates at a max clock frequency of 24 MHz and has flash programmable ROM. This microcontroller is commonly used in industrial applications due to its temperature grade and moisture sensitivity level.

Median Price

$17.129

Lifecycle Status

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1k+

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Arrow

USA . 1 parts In-Stock

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$15.160

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$15.160

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Chip1Stop

Japan . 1 parts In-Stock

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$15.160

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1

$15.160

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Mouser Electronics

USA . 154 parts In-Stock

1+ parts

$25.820

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$18.850

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$18.790

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154

$25.820

$18.850

$18.790

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DigiKey

USA . 80 parts In-Stock

1+ parts

$29.020

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$21.992

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$19.438

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80

$29.020

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$19.438

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Verical

USA . 9,828 parts In-Stock

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$17.448

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Flip Electronics (Authorized)

USA . 3,335 parts In-Stock

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RS (Exports)

UK . 163 parts In-Stock

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$19.209

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Future Electronics

Canada . 9 parts In-Stock

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$14.610

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Rochester

USA . 4 parts In-Stock

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$16.810

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$15.040

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$14.150

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$14.150

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Digiode

USA . 4,739 parts In-Stock

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$13.908

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Nova Conductors

Japan . 60 parts In-Stock

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$20.360

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Flip Electronics

USA . 3,024 parts In-Stock

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Vyrian

USA . 2,747 parts In-Stock

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NAC Semi

USA . 1,134 parts In-Stock

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$25.080

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$23.150

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$23.150

Anansix

USA . 364 parts In-Stock

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IBS Electronics

USA . 9 parts In-Stock

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$23.225

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$22.174

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$22.174

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Corphita

USA . 2,122 parts In-Stock

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$13.176

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Aranea Global

USA . 1,000 parts In-Stock

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$19.953

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$19.155

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$19.953

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Vigor

Singapore . 89 parts In-Stock

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$25.540

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$25.540

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Ampacity Inc.

Singapore . 355 parts In-Stock

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$27.080

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Microchip USA

USA . 1,379 parts In-Stock

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Lixinc

USA . 16,001 parts In-Stock

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UNI Independent Distributors

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Futuretech Components

Singapore . 1,500 parts In-Stock

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Authorized Procurement Solutions

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Overview

Experience the superior quality and performance of the LPC2458FET180,551 microcontroller by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors delivers cutting-edge solutions that meet the demands of today's technology-driven world. The LPC2458FET180,551 offers a wide range of applications, from industrial automation to consumer electronics, providing unmatched value and benefits to our customers. With its advanced features and reliable functionality, this microcontroller empowers you to create innovative and efficient solutions. Discover the advantages of NXP Semiconductors and unlock the full potential of your projects with the LPC2458FET180,551.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This package material ensures durability and lightweight, making it a practical choice for portable devices.

Surface Mount:

YES - The surface mount feature allows for easy and efficient installation on printed circuit boards.

Maximum Supply Voltage:

3.6 V - With a higher voltage tolerance, this microcontroller can handle a wider range of power sources, providing flexibility in various applications.

Address Bus Width:

20 - A wider address bus width allows for increased memory addressing capability, enabling the microcontroller to handle larger data sets.

Package Shape:

SQUARE - The square shape of the package allows for efficient use of space in compact designs.

Bit Size:

32 - A large bit size enables the microcontroller to process data more efficiently and handle complex tasks effectively.

DAC Channels:

YES - The presence of DAC channels allows the microcontroller to convert digital signals into analog output, making it suitable for applications requiring precise analog control.

Power Supplies (V):

3.3 - Supporting a common voltage level of 3.3 V ensures compatibility with various power sources and simplifies integration with other components.

No. of Terminals:

180 - The high number of terminals provides ample connectivity options, allowing for extensive external device integration and I/O capabilities.

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH - The grid array, thin profile, and fine pitch package style offers excellent connection density and compactness, making it suitable for space-constrained designs.

Minimum Supply Voltage:

3 V - With a low minimum supply voltage, this microcontroller can operate efficiently even under low-power conditions, increasing energy-saving potential.

Maximum Operating Temperature:

85 °C - The high maximum operating temperature enables this microcontroller to withstand harsh environmental conditions, enhancing its reliability and durability.

CPU Family:

ARM7 - Based on the ARM7 processor architecture, this microcontroller offers powerful performance and a wide range of software development tools and resources.

Minimum Operating Temperature:

40 °C - The low minimum operating temperature allows this microcontroller to perform reliably even in extremely cold conditions, expanding its usability in various environments.

Terminal Finish:

TIN SILVER COPPER - The use of tin, silver, and copper finish on the terminal enhances conductivity and improves solderability, ensuring reliable connections and ease of assembly.

ADC Channels:

YES - The presence of ADC channels enables the microcontroller to acquire analog signals accurately, making it suitable for applications that require analog data processing.

DMA Channels:

YES - The availability of DMA channels allows for efficient data transfers between peripherals and memory, optimizing system performance and reducing CPU load.

Terminal Position:

BOTTOM - The bottom terminal position facilitates easier PCB layout and soldering, simplifying the assembly process and saving valuable space.

ROM Words:

524288 - With a large ROM capacity, this microcontroller can store extensive program code and data, offering versatility for varied application requirements.

Maximum Seated Height:

1.2 mm - The low seated height allows for compact and slim designs, enabling the microcontroller to be used in space-limited applications.

Width:

12 mm - The narrow width of the microcontroller makes it suitable for designs with limited board space, providing more flexibility for compact product dimensions.

External Data Bus Width:

16 - A wider external data bus width enables faster data transfer between the microcontroller and external memory or devices, enhancing overall system performance.

Maximum Clock Frequency:

24 MHz - With a high clock frequency, this microcontroller can execute instructions quickly, allowing for efficient real-time processing and operation.

Maximum Time At Peak Reflow Temperature (s):

30 - The longer time at peak reflow temperature ensures proper soldering and reliability during assembly, minimizing potential defects.

Peak Reflow Temperature °C:

260 - The high peak reflow temperature ensures secure soldering and robust connections, guaranteeing quality during manufacturing.

Length:

12 mm - The compact length of the microcontroller contributes to its versatility in various small form factor designs.

Temperature Grade:

INDUSTRIAL - Designed for industrial temperature ranges, this microcontroller can operate reliably in harsh environments with high temperature fluctuations.

Peripheral IC Type:

MICROCONTROLLER, RISC - Being a RISC-based microcontroller, it offers efficient and simplified instruction execution, enabling faster processing and better performance.

RAM Bytes:

100352 - With a large RAM capacity, this microcontroller can accommodate extensive data storage requirements, enabling efficient multitasking and data manipulation.

Technology:

CMOS - Utilizing CMOS technology allows this microcontroller to operate at low power consumption levels while offering high performance and noise immunity.

Terminal Form:

BALL - The ball terminal form provides reliable electrical connections and ease of soldering, ensuring secure interconnections on the circuit board.

Nominal Supply Voltage:

3.3 V - Having a consistent and stable nominal supply voltage simplifies system design and compatibility with various power sources.

PWM Channels:

YES - The availability of PWM channels allows precise control of analog signals, making this microcontroller suitable for applications requiring accurate modulation or motor control.

ROM Programmability:

FLASH - The use of flash memory for ROM programming provides flexibility, allowing for easy updates and modifications to the microcontroller's firmware.

Terminal Pitch:

0.8 mm - The narrow terminal pitch enables high pin density, facilitating efficient utilization of available space on the PCB.

Moisture Sensitivity Level (MSL):

3 - With an MSL of 3, this microcontroller has moderate moisture sensitivity, requiring proper handling and precautions during manufacturing and storage.

Speed:

72 rpm - The high speed capability of the microcontroller allows for rapid execution of instructions and efficient data processing, enhancing overall system performance.

No. of I/O Lines:

136 - The generous number of I/O lines enables versatile connectivity options, facilitating integration with external devices and expanding the microcontroller's capabilities.

Technical Specifications

Microcontrollers LPC2458FET180,551 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

20

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

24 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PBGA-B180

JESD-609 Code:

e1

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

136

No. of Terminals:

180

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA180,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

100352

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

LPC2458FET180,551 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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