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LPC2387FBD100,551

NXP Semiconductors

LPC2387FBD100,551 by NXP Semiconductors

NXP Semiconductors' LPC2387FBD100,551 is a 32-bit ARM7 microcontroller with 3.3V power supply, 24MHz clock frequency, and 70 I/O lines. Ideal for industrial applications, it features DAC and ADC channels, DMA support, and FLASH ROM programmability for versatile embedded system designs.

Median Price

$12.920

Lifecycle Status

Suppliers In-Stock

9

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Nova Conductors

Japan . 450 parts In-Stock

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Ampacity Inc.

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Continental Prestige Electronics

USA . 5,364 parts In-Stock

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Advanced Electronics

New Zealand . 450 parts In-Stock

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AZTECH Wire

Italy . 333 parts In-Stock

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Semicontronic

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Microchip USA

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Overview

Elevate your projects with the LPC2387FBD100,551 microcontroller by NXP Semiconductors, a top-tier manufacturer known for quality and reliability. This versatile device is perfect for a wide range of applications thanks to its advanced features like DAC and ADC channels, PWM capabilities, and fast clock frequency. With a compact square package shape and low profile design, this microcontroller offers convenience without sacrificing performance. Experience seamless operation and exceptional value with the LPC2387FBD100,551 - the perfect choice for industrial-grade projects that demand precision and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability of the microcontroller package.

Surface Mount: YES

Surface mount capability enables easy integration onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

Allows for a higher supply voltage, providing flexibility in power requirements for various applications.

Package Shape: SQUARE

Square shape offers uniformity and ease of handling during installation.

Bit Size: 32

The 32-bit architecture allows for higher processing power and performance in computing tasks.

DAC Channels: YES

Digital-to-analog converter channels enable the microcontroller to interface with analog components or sensors.

Power Supplies (V): 3.3

Operates efficiently with a standard voltage supply of 3.3V, ideal for low power consumption applications.

No. of Terminals: 100

A higher number of terminals allow for more connectivity options and interfaces with external devices or peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, fine pitch design offers space-saving benefits and high-density packaging for compact systems.

CPU Family: ARM7

ARM7 architecture provides a balance of performance, power efficiency, and versatility for embedded applications.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, the microcontroller can withstand extreme cold environments or temperature variations.

Maximum Clock Frequency: 24 MHz

The high clock frequency allows for faster processing and data transfer rates, suitable for real-time applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in the microcontroller ensures efficient and streamlined operation of peripheral devices and functions.

ROM Words: 524288

Large ROM capacity provides ample storage for program instructions and data, supporting complex applications and algorithms.

RAM Bytes: 100352

A significant amount of RAM allows for efficient data processing and temporary storage, improving overall system performance.

Technical Specifications

Microcontrollers LPC2387FBD100,551 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

24 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

70

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

100352

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LPC2387FBD100,551 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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