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LPC2366FBD100,551

NXP Semiconductors

LPC2366FBD100,551 by NXP Semiconductors

NXP Semiconductors' LPC2366FBD100,551 is a 32-bit ARM7 microcontroller with 262144 ROM words and 59392 RAM bytes. It operates at a max clock frequency of 25 MHz and has DAC, ADC, and PWM channels for industrial applications requiring high-speed processing and precise analog control.

Median Price

$10.630

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,530 parts In-Stock

1+ parts

-

100+ parts

$10.630

1k+ parts

$9.510

10k+ parts

$8.950

1,530

-

$10.630

$9.510

$8.950

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$8.433

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50

$8.433

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Vyrian

USA . 4,331 parts In-Stock

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4,331

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Digiode

USA . 4,196 parts In-Stock

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Anansix

USA . 1,707 parts In-Stock

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Flip Electronics

USA . 1,260 parts In-Stock

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1,260

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Semtec, LLC

USA . 8 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 676 parts In-Stock

1+ parts

$8.433

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676

$8.433

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Netroflash

USA . 500 parts In-Stock

1+ parts

$8.433

100+ parts

$8.265

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500

$8.433

$8.265

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Continental Prestige Electronics

USA . 311 parts In-Stock

1+ parts

$8.433

100+ parts

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$8.265

311

$8.433

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-

$8.265

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$8.686

100+ parts

$8.252

1k+ parts

$8.252

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-

2,000

$8.686

$8.252

$8.252

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One Stop Electronics

USA . 523 parts In-Stock

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$9.000

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523

$9.000

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Ampacity Inc.

Singapore . 1,562 parts In-Stock

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$10.000

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Semicontronic

India . 1,378 parts In-Stock

1+ parts

$11.000

100+ parts

$10.725

1k+ parts

$10.670

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1,378

$11.000

$10.725

$10.670

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AZTECH Wire

Italy . 566 parts In-Stock

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$14.902

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566

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Microchip USA

USA . 904 parts In-Stock

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$33.421

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904

$33.421

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Aztec Data Supply Inc.

USA . 1,956 parts In-Stock

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$49.530

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Perfect Parts

USA . 67,200 parts In-Stock

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Lixinc

USA . 11,562 parts In-Stock

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UNI Independent Distributors

Spain . 6,299 parts In-Stock

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6,299

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Robosynatics

Brazil . 3,976 parts In-Stock

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3,976

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Lucentia Tech

USA . 3,976 parts In-Stock

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$8.264

1k+ parts

$8.096

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$8.096

3,976

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$8.096

$8.096

Corphita

USA . 3,378 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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Epart123

USA . 1,350 parts In-Stock

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$20.900

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$20.900

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Argo Parts USA

USA . 1,169 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Overview

Unleash the power of innovation with the LPC2366FBD100,551 by NXP Semiconductors. Crafted with precision and expertise, this microcontroller offers unparalleled reliability and performance. Ideal for a wide range of applications, this cutting-edge product delivers exceptional value and benefits to customers seeking seamless integration and top-notch efficiency. Elevate your projects to new heights with the LPC2366FBD100,551 and experience the difference that quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and heat-resistant, making the microcontroller suitable for a variety of applications.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options while ensuring safe operation within the specified range.

Bit Size: 32

Offers high computational capability and efficient data processing for complex tasks.

ADC Channels: YES

Enables analog-to-digital conversion, allowing the microcontroller to interface with a wide range of sensors and input devices.

DAC Channels: YES

Enables digital-to-analog conversion, providing output signals in analog form for various applications.

Technical Specifications

Microcontrollers LPC2366FBD100,551 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

70

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

59392

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LPC2366FBD100,551 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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