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LPC2364HBD100,551

NXP Semiconductors

LPC2364HBD100,551 by NXP Semiconductors

NXP Semiconductors' LPC2364HBD100,551 is a 32-bit ARM7 microcontroller with 131072 ROM words and 34816 RAM bytes. It operates at up to 25 MHz, has 70 I/O lines, and features ADC and DMA channels. Ideal for automotive applications due to its -40°C to 125°C operating temperature range.

Median Price

$14.175

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 45 parts In-Stock

1+ parts

$10.792

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45

$10.792

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Arrow

USA . 360 parts In-Stock

1+ parts

$14.175

100+ parts

$10.172

1k+ parts

$9.659

10k+ parts

-

360

$14.175

$10.172

$9.659

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Verical

USA . 360 parts In-Stock

1+ parts

$14.175

100+ parts

$10.172

1k+ parts

$9.659

10k+ parts

-

360

$14.175

$10.172

$9.659

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DigiKey

USA . 47 parts In-Stock

1+ parts

$17.230

100+ parts

$11.857

1k+ parts

$11.019

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47

$17.230

$11.857

$11.019

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Mouser Electronics

USA . 33 parts In-Stock

1+ parts

$17.290

100+ parts

$11.580

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$10.420

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33

$17.290

$11.580

$10.420

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Rochester

USA . 20 parts In-Stock

1+ parts

-

100+ parts

$8.640

1k+ parts

$7.730

10k+ parts

$7.270

20

-

$8.640

$7.730

$7.270

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,799 parts In-Stock

1+ parts

$9.120

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1,799

$9.120

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Vyrian

USA . 4,620 parts In-Stock

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4,620

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Anansix

USA . 564 parts In-Stock

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564

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TME

Poland . 180 parts In-Stock

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$13.433

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180

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$13.433

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Flip Electronics

USA . 90 parts In-Stock

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90

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Distributors (Availability)

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Corphita

USA . 379 parts In-Stock

1+ parts

$8.640

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379

$8.640

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Vigor

Singapore . 20 parts In-Stock

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$14.450

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20

$14.450

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Microchip USA

USA . 976 parts In-Stock

1+ parts

$49.080

100+ parts

$48.380

1k+ parts

$48.030

10k+ parts

$47.680

976

$49.080

$48.380

$48.030

$47.680

UNI Independent Distributors

Spain . 6,227 parts In-Stock

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Perfect Parts

USA . 202 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the LPC2364HBD100,551 by NXP Semiconductors. This top-of-the-line microcontroller boasts unparalleled quality and reliability, making it the perfect choice for a wide range of applications. From automotive to industrial automation, this product offers unmatched value, benefits, and advantages to customers looking for seamless performance and efficiency. Elevate your projects with the LPC2364HBD100,551 and experience the difference that NXP Semiconductors brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material helps in reducing overall weight of the product without compromising on strength.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power input and compatibility with a wide range of power sources.

Bit Size: 32

Provides higher processing capabilities and performance for handling complex tasks efficiently.

ADC Channels: YES

Enables analog-to-digital conversion for precise measurements and sensor data processing.

ROM Words: 131072

Ample ROM storage capacity for storing program instructions and data, enabling versatile application possibilities.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes RISC architecture for efficient and optimized performance in handling various tasks, making it ideal for microcontroller applications.

RAM Bytes: 34816

Adequate RAM capacity for temporary data storage and efficient multitasking capabilities.

PWM Channels: YES

Supports Pulse Width Modulation (PWM) for precise control of output signals, ideal for motor control and power management.

Technical Specifications

Microcontrollers LPC2364HBD100,551 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

25 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

70

No. of Terminals:

100

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

34816

ROM Words:

131072

ROM Programmability:

FLASH

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LPC2364HBD100,551 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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