Loading...

LPC2364FBD100,551

NXP Semiconductors

LPC2364FBD100,551 by NXP Semiconductors

LPC2364FBD100,551 by NXP Semiconductors is a 32-bit ARM7 microcontroller with 131072 ROM words and 34816 RAM bytes. It operates at a max clock frequency of 25 MHz and has 70 I/O lines, making it ideal for industrial applications requiring high-speed processing and extensive input/output capabilities. With features like DAC and ADC channels, as well as PWM functionality, this microcontroller offers versatile performance in various embedded systems.

Median Price

$9.304

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 58,922 parts In-Stock

1+ parts

$6.500

100+ parts

$6.370

1k+ parts

$6.240

10k+ parts

-

58,922

$6.500

$6.370

$6.240

-

Arrow

USA . 270 parts In-Stock

1+ parts

$8.288

100+ parts

$7.969

1k+ parts

-

10k+ parts

-

270

$8.288

$7.969

-

-

Farnell

UK . 35 parts In-Stock

1+ parts

$10.320

100+ parts

$7.220

1k+ parts

$6.050

10k+ parts

-

35

$10.320

$7.220

$6.050

-

Verical

USA . 120 parts In-Stock

1+ parts

$13.115

100+ parts

$11.328

1k+ parts

$11.099

10k+ parts

-

120

$13.115

$11.328

$11.099

-

Element14

Singapore . 35 parts In-Stock

1+ parts

$16.190

100+ parts

$12.100

1k+ parts

$10.130

10k+ parts

-

35

$16.190

$12.100

$10.130

-

Avnet

USA . 90 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$6.428

10k+ parts

$6.344

90

-

-

$6.428

$6.344

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,978 parts In-Stock

1+ parts

$6.175

100+ parts

-

1k+ parts

-

10k+ parts

-

3,978

$6.175

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$7.572

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$7.572

-

-

-

Vyrian

USA . 7,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,700

-

-

-

-

Anansix

USA . 2,638 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,638

-

-

-

-

Flip Electronics

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

250

-

-

-

-

Schukat

Germany . 250 parts In-Stock

1+ parts

-

100+ parts

$5.150

1k+ parts

-

10k+ parts

-

250

-

$5.150

-

-

Bristol Electronics

USA . 6 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6

-

-

-

-

Atlantic Semiconductor

USA . 6 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6

-

-

-

-

Prism Electronics

USA . 1 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 19,733 parts In-Stock

1+ parts

$5.520

100+ parts

$5.382

1k+ parts

$5.354

10k+ parts

-

19,733

$5.520

$5.382

$5.354

-

Ampacity Inc.

Singapore . 19,499 parts In-Stock

1+ parts

$5.520

100+ parts

-

1k+ parts

-

10k+ parts

-

19,499

$5.520

-

-

-

Corphita

USA . 4,305 parts In-Stock

1+ parts

$5.850

100+ parts

-

1k+ parts

-

10k+ parts

-

4,305

$5.850

-

-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$7.572

100+ parts

-

1k+ parts

$7.193

10k+ parts

$7.042

2,000

$7.572

-

$7.193

$7.042

Continental Prestige Electronics

USA . 658 parts In-Stock

1+ parts

$7.572

100+ parts

-

1k+ parts

-

10k+ parts

$7.420

658

$7.572

-

-

$7.420

AZTECH Wire

Italy . 194 parts In-Stock

1+ parts

$18.140

100+ parts

-

1k+ parts

-

10k+ parts

-

194

$18.140

-

-

-

Corohmni

South Africa . 3 parts In-Stock

1+ parts

$46.059

100+ parts

-

1k+ parts

-

10k+ parts

-

3

$46.059

-

-

-

Aztec Data Supply Inc.

USA . 389 parts In-Stock

1+ parts

$84.765

100+ parts

-

1k+ parts

-

10k+ parts

-

389

$84.765

-

-

-

Lixinc

USA . 12,814 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,814

-

-

-

-

UNI Independent Distributors

Spain . 5,905 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,905

-

-

-

-

Kepictronics

USA . 4,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,800

-

-

-

-

Epart123

USA . 1,800 parts In-Stock

1+ parts

-

100+ parts

$78.500

1k+ parts

-

10k+ parts

-

1,800

-

$78.500

-

-

Futuretech Components

Singapore . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Perfect Parts

USA . 536 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

536

-

-

-

-

Argo Parts USA

USA . 256 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

256

-

-

-

-

Overview

Discover the LPC2364FBD100,551 by NXP Semiconductors, a top-of-the-line microcontroller that offers unparalleled quality and reliability. With a powerful ARM7 CPU family and 32-bit architecture, this device is perfect for a wide range of applications. From industrial automation to consumer electronics, the LPC2364FBD100,551 delivers high performance and efficiency. Trust in NXP Semiconductors' expertise in semiconductor technology to provide you with a cutting-edge solution that will exceed your expectations. Upgrade your projects with the LPC2364FBD100,551 and experience the benefits of superior design and innovation.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - Durable and lightweight material for reliable performance.

Surface Mount

YES - Easy and efficient installation process.

Maximum Supply Voltage

3.6 V - Provides flexibility in power supply options.

Package Shape

SQUARE - Compact design for space-saving applications.

Bit Size

32 - High processing power for complex tasks.

DAC Channels

YES - Ability to convert digital signals to analog for versatile functionality.

Power Supplies (V)

3.3 - Standard voltage for compatibility with various systems.

No. of Terminals

100 - Sufficient connectivity options for different components.

Package Style (Meter)

FLATPACK, LOW PROFILE, FINE PITCH - Modern packaging for enhanced reliability.

Minimum Supply Voltage

3 V - Efficient power consumption for energy savings.

Maximum Operating Temperature

85 °C - Suitable for varying environmental conditions.

CPU Family

ARM7 - Established brand for trusted performance.

Minimum Operating Temperature

40 °C - Operates reliably in extreme cold environments.

Terminal Finish

TIN - Corrosion-resistant finish for long-lasting use.

ADC Channels

YES - Ability to convert analog signals to digital for data processing.

DMA Channels

YES - Efficient data transfer capabilities for improved performance.

Terminal Position

QUAD - Versatile terminal layout for easy connectivity.

ROM Words

131072 - Large memory capacity for storing data and programs.

Maximum Seated Height

1.6 mm - Low profile design for compact installations.

Width

14 mm - Compact size for space-constrained applications.

External Data Bus Width

16 - High data transfer capability for fast processing.

Maximum Clock Frequency

25 MHz - High-speed processing for quick response times.

Maximum Time At Peak Reflow Temperature (s)

30 - Efficient reflow process for reliable solder connections.

Peak Reflow Temperature °C

260 - High-temperature tolerance for durable performance.

Length

14 mm - Compact size for versatile installation options.

Temperature Grade

INDUSTRIAL - Suitable for industrial applications with rugged performance.

Peripheral IC Type

MICROCONTROLLER, RISC - Advanced technology for efficient processing.

RAM Bytes

34816 - Ample memory for data storage and processing.

Technology

CMOS - Modern technology for efficient power consumption.

Terminal Form

GULL WING - Robust terminal design for secure connections.

Maximum Supply Current

100 mA - Stable current supply for consistent performance.

Nominal Supply Voltage

3.3 V - Standard voltage level for compatibility with various systems.

PWM Channels

YES - Ability to generate pulse-width modulation signals for precise control.

ROM Programmability

FLASH - Easily programmable memory for customization.

Terminal Pitch

0.5 mm - Fine pitch for precise connection points.

Moisture Sensitivity Level (MSL)

3 - Suitable for moderate humidity environments.

Speed

72 rpm - Efficient processing speed for quick operations.

No. of I/O Lines

70 - Versatile input/output options for diverse connectivity.

Technical Specifications

Microcontrollers LPC2364FBD100,551 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

70

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

34816

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LPC2364FBD100,551 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20