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LPC2138FHN64/01,55

NXP Semiconductors

LPC2138FHN64/01,55 by NXP Semiconductors

NXP Semiconductors' LPC2138FHN64/01,55 is a 32-bit ARM7 microcontroller with 3.3V power supply, 60MHz clock frequency, and 32768 bytes of RAM. Ideal for industrial applications, it features DAC and ADC channels, flash ROM programmability, and 47 I/O lines for versatile connectivity in compact form factor (9mm x 9mm).

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Vyrian

USA . 5,813 parts In-Stock

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Digiode

USA . 2,755 parts In-Stock

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Anansix

USA . 1,842 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Semtec, LLC

USA . 2 parts In-Stock

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AZTECH Wire

Italy . 320 parts In-Stock

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$12.650

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Ampacity Inc.

Singapore . 1,068 parts In-Stock

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One Stop Electronics

USA . 898 parts In-Stock

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Corohmni

South Africa . 696 parts In-Stock

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Microchip USA

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UNI Independent Distributors

Spain . 7,542 parts In-Stock

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Corphita

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Netroflash

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Overview

Discover the LPC2138FHN64/01,55 by NXP Semiconductors, a cutting-edge microcontroller that combines high-performance with reliability. NXP Semiconductors is renowned for its top-quality products, and this chip carrier boasts a wide range of applications in various industries. From automotive to consumer electronics, this ARM7 CPU family microcontroller offers seamless integration, powerful ADC and DAC channels, and impressive ROM and RAM capacities. With a maximum clock frequency of 60 MHz and industrial-grade temperature range, the LPC2138FHN64/01,55 delivers unmatched value and efficiency for your projects. Elevate your designs with NXP Semiconductors' superior technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for a variety of environments.

Surface Mount: YES

Surface mount technology allows for compact and efficient placement on circuit boards, saving space and enabling smaller designs.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power input, making the microcontroller versatile for different applications.

Package Shape: SQUARE

The square package shape is easy to handle and integrate into circuit designs, offering simplicity in layout planning.

Bit Size: 32

The 32-bit architecture provides high computational capabilities, allowing for complex operations and calculations to be performed efficiently.

DAC Channels: YES

Digital-to-analog converter channels enable the microcontroller to interact with analog components, expanding its capabilities for sensor interfacing and control.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this microcontroller can function reliably in cold environments without risk of performance degradation.

ADC Channels: YES

Analog-to-digital converter channels allow the microcontroller to convert analog signals into digital data, enhancing its ability to process sensor inputs and measurements.

ROM Words: 524288

With a large ROM capacity, the microcontroller can store a significant amount of program data and instructions, supporting complex firmware and software requirements.

Maximum Clock Frequency: 60 MHz

The high maximum clock frequency enables the microcontroller to execute instructions at a rapid pace, improving overall performance and responsiveness.

PWM Channels: YES

Pulse-width modulation channels allow for precise control of output signals, making the microcontroller suitable for applications such as motor control and power regulation.

Technical Specifications

Microcontrollers LPC2138FHN64/01,55 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

8

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

60 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

47

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

60 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

9 mm

Peripheral IC Type:

Trade Compliance

LPC2138FHN64/01,55 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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