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LPC2136FBD64,151

NXP Semiconductors

LPC2136FBD64,151 by NXP Semiconductors

NXP Semiconductors' LPC2136FBD64,151 is a 32-bit ARM7 microcontroller with 8-bit address and data bus width. Operating at up to 25 MHz, it features 32768 bytes of RAM and 262144 words of ROM programmable flash memory. Ideal for industrial applications requiring high-speed processing and multiple ADC/DAC channels.

Median Price

$562.493

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 450 parts In-Stock

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$562.493

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450

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Digiode

USA . 4,678 parts In-Stock

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Vyrian

USA . 2,646 parts In-Stock

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2,646

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Anansix

USA . 1,708 parts In-Stock

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1,708

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Distributors (Availability)

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AZTECH Wire

Italy . 849 parts In-Stock

1+ parts

$18.666

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849

$18.666

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One Stop Electronics

USA . 916 parts In-Stock

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$22.000

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916

$22.000

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Ampacity Inc.

Singapore . 457 parts In-Stock

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$24.000

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Microchip USA

USA . 212 parts In-Stock

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$98.677

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212

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Continental Prestige Electronics

USA . 6,180 parts In-Stock

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$562.493

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$551.243

6,180

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$551.243

Argo Parts USA

USA . 943 parts In-Stock

1+ parts

$562.493

100+ parts

$556.868

1k+ parts

$551.243

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$545.618

943

$562.493

$556.868

$551.243

$545.618

Corphita

USA . 3,907 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$551.243

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$534.368

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$523.118

1,000

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$551.243

$534.368

$523.118

UNI Independent Distributors

Spain . 390 parts In-Stock

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390

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Overview

Looking for a reliable and versatile microcontroller for your next project? Look no further than the LPC2136FBD64,151 by NXP Semiconductors. With a powerful ARM7 CPU family, this microcontroller is perfect for a wide range of applications. From industrial automation to consumer electronics, the LPC2136FBD64,151 offers exceptional performance and efficiency. Trust in NXP Semiconductors' reputation for quality and innovation, and unlock endless possibilities with the LPC2136FBD64,151. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the microcontroller lightweight and durable, suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easier and more efficient PCB assembly, saving time and cost in production.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for flexibility in power supply options and compatibility with different systems.

Address Bus Width: 8

An address bus width of 8 allows for access to a larger memory space, enhancing the microcontroller's performance in data handling.

Package Shape: SQUARE

The square package shape can save space on the PCB and facilitate easier placement within the system design.

Bit Size: 32

A 32-bit architecture provides increased processing power and efficiency, making the microcontroller suitable for complex tasks and calculations.

DAC Channels: YES

The presence of DAC channels enables the generation of analog signals, expanding the range of applications where the microcontroller can be used.

Power Supplies (V): 3.3

The nominal supply voltage of 3.3V ensures compatibility with standard power sources and enhances the reliability of the microcontroller.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options for peripherals and external components, making the microcontroller versatile in system integration.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The package style with a flatpack design, low profile, and fine pitch terminals is space-saving and facilitates high-density PCB layout.

Minimum Supply Voltage: 3 V

The low minimum supply voltage requirement of 3V extends the range of compatible power sources and enhances the microcontroller's versatility.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the microcontroller can withstand harsh environmental conditions and high-temperature operation.

CPU Family: ARM7

Being part of the ARM7 CPU family ensures compatibility with a wide range of software and development tools, simplifying the programming and integration process.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C makes the microcontroller suitable for use in cold environments or industrial applications with extreme temperature variations.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to convert analog signals to digital data, enhancing its capabilities in sensing and measurement applications.

Terminal Position: QUAD

The quad terminal position allows for easy soldering and connection to the PCB, simplifying the assembly process and ensuring secure electrical connections.

ROM Words: 262144

With a ROM size of 262144 words, the microcontroller can store a large amount of program data, facilitating the implementation of complex algorithms and functions.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6mm reduces the overall profile of the microcontroller, making it suitable for compact and space-constrained designs.

Width: 10 mm

A compact width of 10mm allows for easy integration into tight spaces and enhances the overall design flexibility of the system.

External Data Bus Width: 8

An external data bus width of 8 enhances data transfer efficiency and speed, improving the overall performance of the microcontroller in data-intensive applications.

Maximum Clock Frequency: 25 MHz

With a maximum clock frequency of 25MHz, the microcontroller can process instructions and data at high speeds, making it suitable for applications that require real-time processing.

Length: 10 mm

A length of 10mm contributes to the compact form factor of the microcontroller, allowing for efficient use of space in system design.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the microcontroller can withstand a wide range of temperature fluctuations and harsh operating conditions typical in industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers simplified instruction set architecture and high performance, making it ideal for applications requiring efficient processing and control capabilities.

RAM Bytes: 32768

With a RAM size of 32768 bytes, the microcontroller has sufficient memory for storing data and variables during program execution, enhancing its processing capabilities.

Technology: CMOS

The use of CMOS technology ensures low power consumption, high noise immunity, and efficient operation, making the microcontroller suitable for battery-powered devices and energy-efficient applications.

Terminal Form: GULL WING

The gull-wing terminal form facilitates easy soldering and inspection during PCB assembly, ensuring reliable and secure connections for the microcontroller.

Nominal Supply Voltage: 3.3 V

Having a nominal supply voltage of 3.3V ensures compatibility with standard power sources and stable operation of the microcontroller within specified voltage limits.

PWM Channels: YES

The availability of PWM channels allows for precise control of analog signals, enabling applications such as motor speed control, LED dimming, and power management.

ROM Programmability: FLASH

The use of flash memory for ROM programmability enables easy reprogramming of the microcontroller's firmware and firmware updates, enhancing its flexibility and adaptability to changing requirements.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, the microcontroller can be easily mounted on a PCB with fine pitch components, enabling high-density integration and miniaturization of the system.

Speed: 60 rpm

Operating at a speed of 60rpm, the microcontroller can handle tasks and computations efficiently, suitable for real-time applications and systems requiring responsive performance.

No. of I/O Lines: 47

Having 47 I/O lines provides ample connectivity options for interfacing with external devices and peripherals, making the microcontroller versatile in controlling and communicating with other system components.

Technical Specifications

Microcontrollers LPC2136FBD64,151 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

8

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3/e4

Length:

10 mm

No. of I/O Lines:

47

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

60 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LPC2136FBD64,151 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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