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LPC2114FBD64/01,151

NXP Semiconductors

LPC2114FBD64/01,151 by NXP Semiconductors

MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Maximum Supply Voltage: 1.95 V;

Median Price

$6.530

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 160 parts In-Stock

1+ parts

$6.530

100+ parts

$6.400

1k+ parts

$6.270

10k+ parts

-

160

$6.530

$6.400

$6.270

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 69 parts In-Stock

1+ parts

$6.204

100+ parts

-

1k+ parts

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10k+ parts

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69

$6.204

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-

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Anansix

USA . 2,837 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,837

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-

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Vyrian

USA . 2,120 parts In-Stock

1+ parts

-

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2,120

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,437 parts In-Stock

1+ parts

$5.877

100+ parts

-

1k+ parts

-

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4,437

$5.877

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-

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Vigor

Singapore . 4,463 parts In-Stock

1+ parts

$8.910

100+ parts

-

1k+ parts

-

10k+ parts

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4,463

$8.910

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Microchip USA

USA . 5,492 parts In-Stock

1+ parts

$11.683

100+ parts

-

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5,492

$11.683

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QUARKTWIN TECHNOLOGY LTD

USA . 24,489 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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24,489

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Kepictronics

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10,000

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UNI Independent Distributors

Spain . 1,830 parts In-Stock

1+ parts

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1,830

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Perfect Parts

USA . 358 parts In-Stock

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358

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Technical Specifications

Microcontrollers LPC2114FBD64/01,151 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

30 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

46

No. of Terminals:

64

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

60 rpm

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LPC2114FBD64/01,151 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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