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LPC2105BBD48,151

NXP Semiconductors

LPC2105BBD48,151 by NXP Semiconductors

NXP Semiconductors' LPC2105BBD48,151 is a 32-bit ARM7 microcontroller with 131072 ROM words and 32768 RAM bytes. Operating at up to 25 MHz, it features 32 I/O lines and PWM channels for various applications in commercial-grade environments. The low-profile flatpack package with a terminal pitch of 0.5 mm makes it suitable for compact designs requiring high-speed processing capabilities.

Median Price

$6.522

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

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Vyrian

USA . 5,223 parts In-Stock

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Digiode

USA . 4,681 parts In-Stock

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Anansix

USA . 147 parts In-Stock

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AZTECH Wire

Italy . 509 parts In-Stock

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$6.378

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Continental Prestige Electronics

USA . 4,168 parts In-Stock

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$6.392

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Netroflash

USA . 2,000 parts In-Stock

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$6.522

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$6.196

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$6.065

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$6.065

One Stop Electronics

USA . 163 parts In-Stock

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$10.000

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Ampacity Inc.

Singapore . 500 parts In-Stock

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$27.000

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QUARKTWIN TECHNOLOGY LTD

USA . 29,946 parts In-Stock

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UNI Independent Distributors

Spain . 7,376 parts In-Stock

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Microchip USA

USA . 5,539 parts In-Stock

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Corphita

USA . 4,143 parts In-Stock

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Argo Parts USA

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Overview

Discover the LPC2105BBD48,151 by NXP Semiconductors, a cutting-edge microcontroller designed to revolutionize your electronic projects. With a powerful ARM7 CPU family and a FLASH ROM programmability, this device offers unmatched performance and flexibility. From robotics to IoT applications, the LPC2105BBD48,151 delivers seamless integration and optimal power efficiency with its 32-bit architecture and innovative technology. Trust in NXP Semiconductors' renowned quality and reliability for all your microcontroller needs. Elevate your designs with the LPC2105BBD48,151 and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/epoxy material provides good strength and durability, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, saving space and reducing production costs.

Maximum Supply Voltage: 1.95 V

Lower maximum supply voltage helps in reducing power consumption and heat dissipation, making the product more energy efficient.

Bit Size: 32

32-bit architecture provides faster processing speeds and better performance compared to lower bit architectures.

Power Supplies (V): 1.8,3.3

Multiple power supply options give flexibility in design and compatibility with various power sources.

No. of Terminals: 48

Having more terminals allows for more connectivity options, making the product more versatile in different applications.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures stable performance even in harsh environments or under heavy loads.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature enables the product to function reliably in cold conditions.

ROM Words: 131072

Large ROM capacity allows for storing more data and program instructions, enabling complex applications to be run smoothly.

RAM Bytes: 32768

Sufficient RAM capacity helps in storing and processing data efficiently, ensuring smooth operation of the product.

Maximum Clock Frequency: 25 MHz

High maximum clock frequency enables fast data processing and execution of commands, improving overall system performance.

Technical Specifications

Microcontrollers LPC2105BBD48,151 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

NO

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3/e4

Length:

7 mm

No. of I/O Lines:

32

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

60 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN/SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

LPC2105BBD48,151 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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