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JN5168-001-M00Z

NXP Semiconductors

JN5168-001-M00Z by NXP Semiconductors

JN5168-001-M00Z by NXP Semiconductors is a 32-bit microcontroller designed for industrial applications, featuring a max supply voltage of 3.6V and operating temp range from -40 °C to 85 °C. It includes ADC and PWM channels, with 262144 ROM words for flexible programming. Ideal for IoT devices, it supports surface mount technology in a compact package.

Median Price

$10.400

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 292 parts In-Stock

1+ parts

-

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$10.400

1k+ parts

$9.310

10k+ parts

$8.760

292

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$10.400

$9.310

$8.760

Distributors (In-Stock)

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Digiode

USA . 2,227 parts In-Stock

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$11.001

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2,227

$11.001

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Vyrian

USA . 4,219 parts In-Stock

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4,219

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DigiKey Marketplace

USA . 469 parts In-Stock

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469

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Anansix

USA . 445 parts In-Stock

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445

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Flip Electronics

USA . 325 parts In-Stock

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325

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Distributors (Availability)

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Corphita

USA . 3,562 parts In-Stock

1+ parts

$10.422

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3,562

$10.422

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Continental Prestige Electronics

USA . 251 parts In-Stock

1+ parts

$13.880

100+ parts

$10.610

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251

$13.880

$10.610

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AZTECH Wire

Italy . 871 parts In-Stock

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$21.170

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871

$21.170

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UNI Independent Distributors

Spain . 6,598 parts In-Stock

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6,598

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Perfect Parts

USA . 470 parts In-Stock

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470

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Overview

Unlock limitless possibilities with the JN5168-001-M00Z microcontroller from NXP Semiconductors, renowned for its exceptional quality and reliability. Perfect for IoT applications, this versatile chip enhances performance while ensuring low power consumption, making it ideal for smart devices. Experience unmatched durability across extreme temperatures, empowering your innovations with confidence. Elevate your projects with NXP’s commitment to excellence and innovation today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material ensures resistance against environmental factors, enhancing reliability.

Surface Mount: YES

Surface mount technology enables compact design and efficient PCB layouts.

Maximum Supply Voltage: 3.6 V

Allows for compatibility with a wide range of power supply systems, making it versatile for different applications.

Bit Size: 32

A 32-bit architecture provides higher processing power and efficiency for complex tasks.

Power Supplies (V): 2.5/3.3

Flexible voltage range supports various application needs, improving adaptability.

No. of Terminals: 27

Sufficient terminals facilitate connectivity with multiple peripherals, enhancing functionality.

Minimum Supply Voltage: 2 V

Lower voltage requirement reduces power consumption, making it energy efficient.

Maximum Operating Temperature: 85 °C

High temperature tolerance ensures reliable operation in demanding environments.

Minimum Operating Temperature: -40 °C

Wide temperature range supports extreme environments, ideal for industrial applications.

ADC Channels: YES

Integrated ADC allows for analog input processing, broadening application possibilities.

ROM Words: 262144

Large ROM capacity enables complex programs and firmware storage, enhancing functionality.

Peak Reflow Temperature °C: 260

High tolerance for reflow soldering processes ensures compatibility with modern manufacturing techniques.

Temperature Grade: INDUSTRIAL

Designed specifically for industrial applications, ensuring durability and reliability under harsh conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture optimizes speed and efficiency for real-time applications.

RAM Bytes: 32768

Ample RAM size supports complex algorithm processing and multitasking.

Nominal Supply Voltage: 3 V

Optimized nominal voltage ensures stable performance across various applications.

PWM Channels: YES

Integrated PWM capabilities enable precise control of motors and other devices, adding versatility.

ROM Programmability: FLASH

Flash programmability allows for easy updates and reprogramming, enhancing flexibility.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity ensures reliability in diverse environments, while allowing for standard handling precautions.

Technical Specifications

Microcontrollers JN5168-001-M00Z attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

DMA Channels:

NO

External Data Bus Width:

0

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

27

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

LCC27(UNSPEC)

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Temperature Grade:

Peripheral IC Type:

Trade Compliance

JN5168-001-M00Z Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992

ECCN Governance

EAR

HTS

8548.00.00.00

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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