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JN5161/001,518

NXP Semiconductors

JN5161/001,518 by NXP Semiconductors

JN5161/001,518 by NXP Semiconductors is a 32-bit microcontroller designed for automotive applications. It operates at a max voltage of 3.6V with a temp range of -40 °C to 125 °C and features 22 I/O lines and ADC channels. Ideal for embedded systems requiring reliability and efficiency.

Median Price

$2.678

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 8,000 parts In-Stock

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$2.678

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Vyrian

USA . 10,314 parts In-Stock

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10,314

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Flip Electronics

USA . 3,995 parts In-Stock

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3,995

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Digiode

USA . 3,055 parts In-Stock

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Anansix

USA . 1,613 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,361 parts In-Stock

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$8.000

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AZTECH Wire

Italy . 170 parts In-Stock

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$22.020

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170

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Component Stockers USA

USA . 1,535 parts In-Stock

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$27.790

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UNI Independent Distributors

Spain . 1,594 parts In-Stock

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Corphita

USA . 1,119 parts In-Stock

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Overview

Unlock the potential of your projects with the JN5161/001,518 microcontroller from NXP Semiconductors—an industry leader renowned for innovation and reliability. This high-performance chip is designed for a wide range of applications, offering exceptional power efficiency and robust performance in challenging environments. Experience seamless integration, enhanced connectivity, and greater design flexibility, empowering you to elevate your products while ensuring long-term value and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides excellent protection and reliability, making this microcontroller suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact PCB designs and improved automation in assembly, making this microcontroller ideal for modern electronics.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller is compatible with low-power applications, extending battery life.

Package Shape: SQUARE

The square package shape facilitates efficient space utilization on the PCB, allowing for more compact designs.

Bit Size: 32

A 32-bit architecture enhances computing power and allows for efficient processing of complex tasks.

Power Supplies (V): 2.5/3.3

Flexible power supply options (2.5 V and 3.3 V) ensure compatibility with a wide range of systems.

No. of Terminals: 40

With 40 terminals, this microcontroller provides ample connectivity options for various peripherals.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This style allows for efficient heat dissipation and makes it suitable for applications requiring thermal management.

Minimum Supply Voltage: 2 V

A minimum supply voltage of 2 V supports operations in low-power scenarios, useful for energy-sensitive applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures reliable performance in demanding environments, such as automotive applications.

Minimum Operating Temperature: -40 °C

This wide temperature range allows the microcontroller to function in harsh conditions, increasing versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish enhances reliability and corrosion resistance, ensuring long-term performance.

ADC Channels: YES

The presence of ADC channels allows for direct analog signal processing, making it suitable for sensor applications.

Terminal Position: QUAD

Quad terminal position improves the electrical performance and stability of connections in the device.

ROM Words: 65536

Ample ROM capability supports complex software and applications, providing flexibility for program storage.

Width: 6 mm

The 6 mm width supports compact designs, making it ideal for space-constrained applications.

Maximum Clock Frequency: 32 MHz

A maximum clock frequency of 32 MHz enables high-speed processing, reducing latency in critical applications.

Maximum Time At Peak Reflow Temperature: 30 s

A peak reflow time of 30 seconds ensures compatibility with modern SMT soldering processes, simplifying manufacturing.

Peak Reflow Temperature: 260 °C

This temperature rating supports compatibility with advanced soldering techniques, enhancing manufacturability.

Length: 6 mm

The length of 6 mm complements the width, contributing to a compact form factor suitable for dense designs.

Temperature Grade: AUTOMOTIVE

Grade for automotive applications ensures reliability and durability in vehicles, a critical requirement for safety.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture offers efficient instruction execution, resulting in lower power consumption and better performance.

RAM Bytes: 8192

8 KB of RAM supports a variety of applications, allowing for complex data processing and storage.

Terminal Form: NO LEAD

No lead terminals contribute to environmental sustainability and facilitate finer pitch designs on PCBs.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V balances performance and energy efficiency, making it a versatile choice for various circuits.

PWM Channels: YES

Integrated PWM channels allow for precise control in motor and lighting applications, enhancing functionality.

ROM Programmability: FLASH

Flash ROM programmability enables easy updates and reprogramming of applications, providing flexibility and longevity.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for higher density designs, maximizing the number of connections in a limited space.

Moisture Sensitivity Level (MSL): 3

This MSL rating indicates appropriate storage and handling practices, ensuring reliability during production.

Speed: 32 rpm

An operational speed of 32 rpm is well-suited for applications in robotics and automation, enhancing performance.

No. of I/O Lines: 22

With 22 I/O lines, this microcontroller supports versatile interfacing options, increasing its applicability in various projects.

Technical Specifications

Microcontrollers JN5161/001,518 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

22

No. of Terminals:

40

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Speed:

32 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Peripheral IC Type:

Trade Compliance

JN5161/001,518 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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