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JN5148/001,531

NXP Semiconductors

JN5148/001,531 by NXP Semiconductors

JN5148/001,531 by NXP Semiconductors is a 32-bit microcontroller designed for industrial applications. It features 131KB ROM and RAM, operates b/w -40 °C to 85 °C, and supports surface mount technology. Ideal for IoT devices, it ensures reliable performance in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 11,730 parts In-Stock

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Anansix

USA . 594 parts In-Stock

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594

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Digiode

USA . 413 parts In-Stock

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413

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AZTECH Wire

Italy . 276 parts In-Stock

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$13.190

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276

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One Stop Electronics

USA . 558 parts In-Stock

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$33.000

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QUARKTWIN TECHNOLOGY LTD

USA . 26,845 parts In-Stock

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UNI Independent Distributors

Spain . 3,457 parts In-Stock

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Corphita

USA . 1,637 parts In-Stock

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Overview

Elevate your projects with the JN5148/001,531 microcontroller by NXP Semiconductors. Renowned for quality and innovation, NXP delivers reliable performance in diverse applications, from industrial automation to smart home devices. With robust temperature tolerance and efficient power supply options, this microcontroller empowers you to achieve seamless connectivity and enhanced functionality, ensuring your designs stand out while optimizing performance and longevity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials enhances durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient PCB utilization, making the product ideal for modern electronic devices.

Package Shape: SQUARE

A square package shape optimizes space on the circuit board and improves thermal performance, ensuring reliability in operation.

Bit Size: 32

The 32-bit architecture enables processing of complex algorithms and larger data sets, providing enhanced performance for applications.

Power Supplies (V): 2.5/3.3

Dual voltage support allows for flexibility in power supply options and compatibility with various systems, facilitating integration.

No. of Terminals: 56

A higher number of terminals provide increased connectivity options, enabling greater functionality and expandability in designs.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging supports multiple mounting configurations and enhances thermal dissipation, making it a robust choice for high-performance applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this microcontroller is suitable for high-temperature environments and industrial applications.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C ensures reliable performance in extreme conditions, making it a great choice for outdoor and challenging applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish ensures excellent reliability and corrosion resistance, enhancing the longevity of connections.

Terminal Position: QUAD

Quad terminal positioning allows for better signal integrity and reduced electromagnetic interference, promoting stable performance.

ROM Words: 131072

With 131072 ROM words available for program storage, this microcontroller offers ample space for complex firmware and software applications.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum peak reflow time of 30 seconds ensures compatibility with standard soldering processes, simplifying manufacturing.

Peak Reflow Temperature °C: 260

Supporting a peak reflow temperature of 260 °C guarantees compatibility with high-quality soldering techniques, crucial for reliability in production.

Temperature Grade: INDUSTRIAL

Industrial temperature grade certification confirms reliability in demanding conditions, making this microcontroller suitable for industrial applications.

RAM Bytes: 131072

A RAM capacity of 131072 bytes allows for efficient data processing and temporary storage, improving the product's performance in real-time applications.

Terminal Form: NO LEAD

No-lead terminal form factor enhances the product's environmental friendliness and simplifies assembly in various device configurations.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications to firmware, maximizing flexibility and usability over the product's lifespan.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm enables dense packaging, allowing for more functionality in smaller form factors, ideal for space-constrained applications.

Moisture Sensitivity Level (MSL): 2A

MSL 2A rating indicates moderate sensitivity to moisture, guiding appropriate handling and storage, which safeguards the reliability of the microcontroller.

Speed: 32 rpm

A speed of 32 rpm specifies the operational proficiency of the microcontroller in timing applications, highlighting suitability for dynamic processing needs.

Technical Specifications

Microcontrollers JN5148/001,531 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

Bit Size:

32

JESD-30 Code:

S-PQCC-N56

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

2A

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC56,.31SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

131072

ROM Words:

131072

ROM Programmability:

FLASH

Speed:

32 rpm

Sub-Category:

Microcontrollers

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

JN5148/001,531 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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