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ICM7555CD-T

NXP Semiconductors

ICM7555CD-T by NXP Semiconductors

ICM7555CD-T by NXP Semiconductors is a CMOS analog waveform generator with a max output frequency of 0.5 GHz and operates b/w 3-16 V. It features an 8-terminal, dual-position design in a compact SO package. Ideal for pulse generation in commercial applications, it withstands temps from 0 °C to 70 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Anansix

USA . 1,693 parts In-Stock

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Zilex Electronics Inc.

Canada . 1,450 parts In-Stock

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Vyrian

USA . 1,427 parts In-Stock

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Digiode

USA . 1,229 parts In-Stock

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EMSNET

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One Stop Electronics

USA . 1,516 parts In-Stock

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$5.500

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Corphita

USA . 4,963 parts In-Stock

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Perfect Parts

USA . 2,800 parts In-Stock

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UNI Independent Distributors

Spain . 2,669 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,560 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,040 parts In-Stock

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Overview

Elevate your projects with the ICM7555CD-T from NXP Semiconductors, a trusted leader in innovative analog solutions. This high-quality waveform generator excels in precision and reliability, offering exceptional performance for a variety of applications, from timers to pulse generators. With its compact design and robust temperature range, it seamlessly integrates into your designs, delivering unmatched value and efficiency that empowers your creativity and drives success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body material provides reliability and resistance to environmental factors, making this product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for smaller footprint on PCBs and enables automated assembly, ensuring efficiency in manufacturing.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easier integration into PCB layouts, optimizing space usage in electronic designs.

Nominal Supply Voltage (Vsup): 5 V

Operating at a nominal supply voltage of 5 V makes this device compatible with a wide range of electronic equipment and systems.

Maximum Output Frequency: 0.5 GHz

With a maximum output frequency of 0.5 GHz, this product is capable of generating high-frequency waveforms, enhancing performance in advanced applications.

Number of Terminals: 8

The 8-terminal configuration allows for versatile pin assignments, facilitating easy integration into diverse circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes space requirements on PCB, making it ideal for compact electronic designs.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliable performance in a variety of conditions, suitable for commercial applications.

Minimum Operating Temperature: 0 °C

The ability to operate from 0 °C allows for versatility in use across different environments, ensuring reliable functionality.

Terminal Position: DUAL

Dual-terminal positioning supports flexible mounting options, simplifying integration into printed circuit boards.

Maximum Seated Height: 1.75 mm

A low seated height of 1.75 mm is beneficial for space-constrained applications, contributing to a slimmer profile in designs.

Width: 3.9 mm

The compact width of 3.9 mm is perfect for achieving high packing density on PCBs without sacrificing performance.

Other IC Type: PULSE

Designed as a pulse IC, this product is ideal for applications requiring accurate timing and signal generation.

Minimum Supply Voltage (Vsup): 3 V

With a minimum supply voltage of 3 V, this product provides flexibility in powering from lower voltage systems.

Maximum Time At Peak Reflow Temperature: 40 s

A maximum peak reflow temperature time of 40 seconds increases reliability during soldering processes, reducing the risk of thermal damage.

Peak Reflow Temperature: 260 °C

This high peak reflow temperature ensures compatibility with various solder materials, enhancing manufacturability.

Length: 4.9 mm

The length of 4.9 mm combined with its width makes it a compact choice for modern electronic designs, facilitating efficient use of PCB space.

Temperature Grade: COMMERCIAL

Rated for commercial temperature grade, this product ensures dependable performance in standard consumer environments.

Technology: CMOS

Using CMOS technology allows for low power consumption and high integration, suitable for battery-powered and portable devices.

Terminal Form: GULL WING

Gull wing terminals promote easy soldering and reliable mechanical strength, enhancing assembly processes.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for compact layout designs while maintaining ease of handling during assembly.

Maximum Supply Voltage (Vsup): 16 V

Supporting a maximum supply voltage of 16 V provides upper flexibility for operation in various advanced electronic applications.

Technical Specifications

Analog Waveform Generation ICM7555CD-T attributes and parameters. Explore more Analog Waveform Generation devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Frequency:

.5 GHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3.9 mm

Trade Compliance

ICM7555CD-T Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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