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HTCICC6402FUG/AM

NXP Semiconductors

HTCICC6402FUG/AM by NXP Semiconductors

HTCICC6402FUG/AM by NXP Semiconductors is a telecom interface IC designed for industrial applications. It features a -40 °C to 85 °C operating temp range, 5 terminals in a no-lead design, and comes in an uncasded chip package. Ideal for robust telecom circuit solutions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 946 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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946

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Digiode

USA . 309 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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309

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Vyrian

USA . 216 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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216

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 629 parts In-Stock

1+ parts

$546.000

100+ parts

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1k+ parts

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10k+ parts

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629

$546.000

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Corphita

USA . 2,890 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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2,890

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UNI Independent Distributors

Spain . 1,697 parts In-Stock

1+ parts

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1,697

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Overview

Unlock your potential with the HTCICC6402FUG/AM from NXP Semiconductors, a leader in innovation and reliability. This versatile telecom interface IC is designed for industrial applications, offering exceptional performance in extreme temperatures, ensuring your systems run smoothly in any environment. With its compact, surface-mount design, you gain efficiency without compromising quality. Elevate your projects with a trusted manufacturer that prioritizes durability and customer satisfaction.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design allows for efficient use of board space and facilitates automated assembly, making it ideal for compact applications.

Package Shape: RECTANGULAR

The rectangular package shape aids in better layout and thermal management, providing improved integration in various designs.

No. of Terminals: 5

With 5 terminals, this IC offers a balance between functionality and complexity, ensuring ease of use in diverse applications.

Package Style (Meter): UNCASED CHIP

The uncaased chip style allows for enhanced thermal performance and integration directly into custom designs.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance in moderately high-temperature environments.

Minimum Operating Temperature: -40 °C

Operating effectively from -40 °C provides versatility for industrial applications in harsh climates.

Terminal Position: UPPER

Upper terminal positioning simplifies the design and layout for PCB assemblies, making it easier to accommodate in various configurations.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature specifications guarantee durability and longevity in demanding environments.

Terminal Form: NO LEAD

No lead terminal form enhances design flexibility and contributes to a compact footprint, suitable for modern electronic applications.

Telecom IC Type: TELECOM CIRCUIT

As a telecom circuit, this IC is optimized for communication applications, ensuring performance aligned with specific industry needs.

Technical Specifications

Other Function Telecom Interface ICs HTCICC6402FUG/AM attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-XUUC-N5

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Trade Compliance

HTCICC6402FUG/AM Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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