Loading...

HTCICC6403FUG/AM

NXP Semiconductors

HTCICC6403FUG/AM by NXP Semiconductors

HTCICC6403FUG/AM by NXP Semiconductors is a robust telecom interface IC designed for industrial applications. It features a wide operating temperature range from -40 °C to 85 °C, a compact rectangular shape with 5 terminals, and no lead design for efficient mounting. Ideal for reliable telecom circuit integration in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,596 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,596

-

-

-

-

Vyrian

USA . 677 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

677

-

-

-

-

Digiode

USA . 91 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

91

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 649 parts In-Stock

1+ parts

$281.000

100+ parts

-

1k+ parts

-

10k+ parts

-

649

$281.000

-

-

-

UNI Independent Distributors

Spain . 4,755 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,755

-

-

-

-

Corphita

USA . 2,246 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,246

-

-

-

-

Overview

Elevate your telecom solutions with the HTCICC6403FUG/AM from NXP Semiconductors, a leader in innovative technology. Engineered for reliability and performance, this high-quality interface IC excels in extreme temperatures, ensuring robust operation for industrial applications. Its compact design makes it perfect for space-constrained environments, delivering superior functionality and efficiency to enhance your products' capabilities. Choose NXP for proven excellence and unlock your system’s true potential!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact integration on PCBs, making it suitable for space-constrained applications.

Package Shape: RECTANGULAR

The rectangular package shape enables efficient use of board space and optimal thermal performance.

No. of Terminals: 5

With five terminals, this IC provides sufficient connectivity for various telecom functions while maintaining a simple interface.

Package Style (Meter): UNCASED CHIP

Being an uncasded chip, it facilitates easier integration into custom designs, enhancing overall flexibility in product development.

Maximum Operating Temperature: 85 °C

The IC can operate at high temperatures up to 85 °C, making it reliable for use in demanding environments.

Minimum Operating Temperature: -40 °C

With a low operating temperature limit of -40 °C, this product is ideal for harsh conditions, ensuring dependable performance in extreme climates.

Terminal Position: UPPER

The upper terminal position allows for easier access and soldering, simplifying the assembly process in production.

Temperature Grade: INDUSTRIAL

Designed with an industrial temperature grade, this product is robust and suitable for long-term use in industrial applications.

Terminal Form: NO LEAD

The no-lead terminal design minimizes the size of the product while also improving thermal and electrical performance.

Telecom IC Type: TELECOM CIRCUIT

As a telecom circuit IC, it is specifically engineered to handle telecom functions, ensuring reliable communication capabilities.

Technical Specifications

Other Function Telecom Interface ICs HTCICC6403FUG/AM attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-XUUC-N5

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Trade Compliance

HTCICC6403FUG/AM Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 4