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HT2DC20S20/F/RSP

NXP Semiconductors

HT2DC20S20/F/RSP by NXP Semiconductors

HT2DC20S20/F/RSP by NXP Semiconductors is a telecom interface IC with a temperature range of -40 to 85°C. This hybrid technology device comes in a rectangular package with silver terminal finish, suitable for industrial-grade applications. It is designed for telecom circuits and supports surface mount installation.

Median Price

$3.080

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 148 parts In-Stock

1+ parts

$0.522

100+ parts

$0.522

1k+ parts

$0.522

10k+ parts

-

148

$0.522

$0.522

$0.522

-

Farnell

UK . 11,575 parts In-Stock

1+ parts

$3.080

100+ parts

$1.940

1k+ parts

$1.790

10k+ parts

-

11,575

$3.080

$1.940

$1.790

-

Chip1Stop

Japan . 3,500 parts In-Stock

1+ parts

$4.560

100+ parts

$2.850

1k+ parts

$2.450

10k+ parts

$2.370

3,500

$4.560

$2.850

$2.450

$2.370

DigiKey

USA . 17,439 parts In-Stock

1+ parts

$4.570

100+ parts

$2.879

1k+ parts

$2.573

10k+ parts

$2.497

17,439

$4.570

$2.879

$2.573

$2.497

Element14

Singapore . 6,323 parts In-Stock

1+ parts

$7.230

100+ parts

$5.060

1k+ parts

$4.540

10k+ parts

-

6,323

$7.230

$5.060

$4.540

-

Rochester

USA . 11,905 parts In-Stock

1+ parts

-

100+ parts

$2.090

1k+ parts

$1.870

10k+ parts

$1.760

11,905

-

$2.090

$1.870

$1.760

Verical

USA . 11,739 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.337

10k+ parts

$2.200

11,739

-

-

$2.337

$2.200

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 139 parts In-Stock

1+ parts

$0.496

100+ parts

-

1k+ parts

-

10k+ parts

-

139

$0.496

-

-

-

Nova Conductors

Japan . 34 parts In-Stock

1+ parts

$2.505

100+ parts

-

1k+ parts

-

10k+ parts

-

34

$2.505

-

-

-

Vyrian

USA . 3,269 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,269

-

-

-

-

Anansix

USA . 2,740 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,740

-

-

-

-

TME

Poland . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.800

10k+ parts

-

2,500

-

-

$2.800

-

Chip Stock

USA . 135 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

135

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,386 parts In-Stock

1+ parts

$0.470

100+ parts

-

1k+ parts

-

10k+ parts

-

3,386

$0.470

-

-

-

Ampacity Inc.

Singapore . 3,656 parts In-Stock

1+ parts

$0.970

100+ parts

-

1k+ parts

-

10k+ parts

-

3,656

$0.970

-

-

-

Semicontronic

India . 3,623 parts In-Stock

1+ parts

$0.970

100+ parts

$0.946

1k+ parts

$0.941

10k+ parts

-

3,623

$0.970

$0.946

$0.941

-

Argo Parts USA

USA . 3,376 parts In-Stock

1+ parts

$2.505

100+ parts

-

1k+ parts

-

10k+ parts

-

3,376

$2.505

-

-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$2.505

100+ parts

-

1k+ parts

$2.380

10k+ parts

$2.330

2,000

$2.505

-

$2.380

$2.330

Corohmni

South Africa . 748 parts In-Stock

1+ parts

$3.120

100+ parts

-

1k+ parts

-

10k+ parts

-

748

$3.120

-

-

-

Continental Prestige Electronics

USA . 6,393 parts In-Stock

1+ parts

$4.530

100+ parts

$2.670

1k+ parts

-

10k+ parts

-

6,393

$4.530

$2.670

-

-

Aztec Data Supply Inc.

USA . 206 parts In-Stock

1+ parts

$10.692

100+ parts

-

1k+ parts

-

10k+ parts

-

206

$10.692

-

-

-

Perfect Parts

USA . 10,080 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,080

-

-

-

-

UNI Independent Distributors

Spain . 4,860 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,860

-

-

-

-

Overview

Designed by NXP Semiconductors, the HT2DC20S20/F/RSP is a versatile and reliable Telecom Interface IC suitable for a wide range of applications. With a temperature range of -40 to 85°C, this industrial-grade hybrid technology ensures optimal performance in various environments. Its unique package shape and silver terminal finish make it easy to mount and integrate into your telecom circuits seamlessly. Enhance your equipment's functionality and efficiency with the HT2DC20S20/F/RSP, providing unmatched quality and value to customers looking for top-notch telecom interface solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product easier to handle and lower in overall cost.

Surface Mount: YES

Surface mount technology allows for more efficient assembly processes and a more compact design, saving space on the PCB.

Package Shape: RECTANGULAR

The rectangular shape is a standard form factor that is compatible with most PCB layouts, making integration easier.

Package Style (Meter): SPECIAL SHAPE

The special shape of the package adds uniqueness and potentially improves heat dissipation or signal processing capabilities.

Maximum Operating Temperature: 85 °C

The high operating temperature range allows the product to function reliably in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

The low operating temperature range ensures the product can continue to operate in cold environments without any issues.

Terminal Finish: SILVER

Silver terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Temperature Grade: INDUSTRIAL

Industrial temperature grade components are designed to withstand harsh conditions and provide consistent performance in demanding applications.

Technology: HYBRID

Hybrid technology combines the benefits of different technologies, potentially offering superior performance or functionality compared to single technology solutions.

Terminal Form: NO LEAD

Lead-free terminals are environmentally friendly and comply with industry regulations while still providing reliable connectivity.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring optimized performance and compatibility for telecommunications systems.

Technical Specifications

Other Function Telecom Interface ICs HT2DC20S20/F/RSP attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PXSS-N

JESD-609 Code:

e4

No. of Functions:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

MODULE(UNSPEC)

Package Shape:

Package Style (Meter):

SPECIAL SHAPE

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Surface Mount:

YES

Technology:

HYBRID

Telecom IC Type:

Temperature Grade:

Terminal Finish:

SILVER

Terminal Form:

Terminal Position:

UNSPECIFIED

Trade Compliance

HT2DC20S20/F/RSP Telecommunications trade compliance attributes, and parameters.

ECCN

5A992

ECCN Governance

EAR

HTS

8542.32.00

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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