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HEF4008BDB

NXP Semiconductors

HEF4008BDB by NXP Semiconductors

HEF4008BDB by NXP Semiconductors is a 4-bit CMOS digital arithmetic circuit with a supply voltage range of 3-15V. It features a propagation delay of 300 ns and operates in temperatures from -40 °C to 85 °C. Ideal for industrial applications, it comes in a ceramic, glass-sealed package.

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Digiode

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Vyrian

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Pegasus Components GmbH

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ComSIT Distribution GmbH

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One Stop Electronics

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Andel Nordic

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Corphita

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UNI Independent Distributors

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Northwest PG Solutions

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Overview

Unlock precision and reliability in your digital designs with the HEF4008BDB from NXP Semiconductors. Crafted with superior quality, this CMOS digital arithmetic circuit is engineered to perform flawlessly even under extreme conditions, making it ideal for industrial applications. Enjoy the benefits of robust performance, low power consumption, and versatility, all packaged in a durable ceramic design. Elevate your projects with NXP's trusted innovation—where excellence meets value!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed body material enhances durability and provides excellent protection against environmental factors, making it suitable for industrial applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient layout and design, facilitating easier integration into various circuit boards.

No. of Bits: 4

With 4 bits, this product offers sufficient data handling capability for many applications in digital arithmetic, balancing complexity and size.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V is a common standard, ensuring compatibility with a wide range of digital circuits and systems.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF indicates efficient handling of signal integrity and faster switching, ideal for high-speed applications.

No. of Terminals: 16

With 16 terminals, this device offers versatile connectivity options for various circuit configurations and easy integration into larger systems.

Package Style (Meter): IN-LINE

The in-line package style is user-friendly for through-hole mounting, making it easier to solder and connect in physical circuitry.

Propagation Delay (tpd): 300 ns

A propagation delay of 300 ns provides good speed for most applications, making it a reliable choice for real-time processing tasks.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product is suitable for a range of environments, supporting reliability in high-temperature settings.

Minimum Operating Temperature: -40 °C

The capability to operate down to -40 °C makes this device suitable for harsh conditions and outdoor applications, enhancing its versatility.

Terminal Position: DUAL

The dual terminal position supports flexibility in layout design, accommodating a variety of circuit board configurations.

Maximum Seated Height: 5.08 mm

With a maximum seated height of 5.08 mm, the device has a compact profile, allowing for space-efficient designs.

Width: 7.62 mm

The width of 7.62 mm contributes to the product's compactness, beneficial for densely packed circuit boards.

Minimum Supply Voltage (Vsup): 3 V

Operating down to a minimum supply voltage of 3V allows this product to function in low-power applications, extending battery life.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades ensures robustness and long-term reliability in demanding applications.

Technology: CMOS

CMOS technology provides high noise immunity and low static power consumption, making this circuit ideal for battery-powered devices.

Terminal Form: THROUGH-HOLE

The through-hole configuration enhances mechanical stability, making it easier to solder and assuring reliable connections in applications.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54 mm is prevalent in many designs, promoting compatibility and ease of use in circuit design.

Maximum Supply Voltage (Vsup): 15 V

The ability to handle up to 15V makes this product versatile, allowing it to work in a variety of applications that require different supply levels.

Technical Specifications

Digital Arithmetic Circuits HEF4008BDB attributes and parameters. Explore more Digital Arithmetic Circuits devices from NXP Semiconductors

Specs

Additional Features:

FULL ADDER; WITH INTERNAL CARRY LOOKAHEAD; PERMITS RIPPLE CARRY CASCADING

Family:

4000/14000/40000

JESD-30 Code:

R-GDIP-T16

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

300 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

HEF4008BDB Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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