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FS32K144HAT0VLLT

NXP Semiconductors

FS32K144HAT0VLLT by NXP Semiconductors

NXP Semiconductors' FS32K144HAT0VLLT microcontroller features 32-bit CPU, 40 MHz clock frequency, and 524288 ROM words. Ideal for automotive applications requiring ISO 26262 screening, it offers low power mode and connectivity options like CAN, I2C, LIN, LPUART, and SPI. With Cortex-M4F CPU family and DMA channels for efficient data transfer.

Median Price

$9.840

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 416 parts In-Stock

1+ parts

$9.840

100+ parts

$6.240

1k+ parts

$5.750

10k+ parts

$5.370

416

$9.840

$6.240

$5.750

$5.370

Mouser Electronics

USA . 440 parts In-Stock

1+ parts

$9.860

100+ parts

$6.310

1k+ parts

$5.100

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-

440

$9.860

$6.310

$5.100

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Verical

USA . 9,900 parts In-Stock

1+ parts

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$5.014

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9,900

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$5.014

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Distributors (In-Stock)

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Digiode

USA . 1,141 parts In-Stock

1+ parts

$8.512

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1,141

$8.512

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Vyrian

USA . 9,611 parts In-Stock

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Anansix

USA . 109 parts In-Stock

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109

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Distributors (Availability)

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Corphita

USA . 2,781 parts In-Stock

1+ parts

$8.064

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2,781

$8.064

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Microchip USA

USA . 2,647 parts In-Stock

1+ parts

$23.220

100+ parts

$22.880

1k+ parts

$22.720

10k+ parts

$22.550

2,647

$23.220

$22.880

$22.720

$22.550

Native Components

USA . 199 parts In-Stock

1+ parts

$159.720

100+ parts

-

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10k+ parts

$153.331

199

$159.720

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-

$153.331

Northwest PG Solutions

USA . 1,576 parts In-Stock

1+ parts

$175.692

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1,576

$175.692

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Infinite Electronics LLP (Excess)

. 5,858 parts In-Stock

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Lixinc

USA . 4,321 parts In-Stock

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4,321

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Futuretech Components

Singapore . 4,050 parts In-Stock

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UNI Independent Distributors

Spain . 1,120 parts In-Stock

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Overview

Unleash the power of innovation with the NXP Semiconductors FS32K144HAT0VLLT microcontroller. Known for its top-notch quality and reliability, NXP Semiconductors has crafted a versatile solution that meets the demands of various applications. From automotive to industrial sectors, this microcontroller offers unmatched performance, efficiency, and flexibility. With integrated cache, wide RAM width, and a plethora of peripherals, it's the ideal choice for those seeking cutting-edge technology. Elevate your projects with the FS32K144HAT0VLLT and experience the value and benefits it brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, ideal for electronic components.

Integrated Cache: YES

Enhanced performance due to caching of frequently accessed data.

Maximum Supply Voltage: 5.5 V

Wide supply voltage range allows for flexibility in power requirements.

On Chip Data RAM Width: 8

Efficient data handling with a wide data RAM width.

Screening Level: ISO 26262

Compliance with automotive safety standards ensures reliability in critical applications.

Bit Size: 32

High processing capability with a 32-bit architecture.

No. of Terminals: 100

Sufficient I/O options for versatile connectivity.

Maximum Operating Temperature: 105 °C

Ability to operate in high-temperature environments.

Minimum Operating Temperature: -40 °C

Suitable for operation in extreme cold conditions.

ADC Channels: YES

Analog-to-digital conversion capability for sensor interfacing.

DMA Channels: YES

Efficient data transfer with Direct Memory Access support.

ROM Words: 524288

Large program storage capacity for complex applications.

CPU Family: CORTEX-M4F

Powerful Cortex-M4F processor architecture for high performance.

Technical Specifications

Microcontrollers FS32K144HAT0VLLT attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of I/O Lines:

89

No. of Serial I/Os:

3

No. of Terminals:

100

No. of Timers:

34

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

65536

ROM Words:

524288

ROM Programmability:

FLASH

Screening Level:

ISO 26262

Maximum Seated Height:

1.7 mm

Speed:

80 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

4096

Connectivity:

CAN(3), I2C, LIN(3), LPUART(3), SPI(3)

Peripherals:

BOR, COMPARATOR, POR, RTC, TIMER(34), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 8-Bit

Trade Compliance

FS32K144HAT0VLLT Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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