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CGD1046HI

NXP Semiconductors

CGD1046HI by NXP Semiconductors

NARROW BAND HIGH POWER; Maximum Operating Frequency: 1003 MHz; Gain: 26.5 dB; Minimum Operating Temperature: -20 Cel; Characteristic Impedance: 75 ohm; JESD-609 Code: e4;

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

ACDS - Activité Composants Distribution Service

France . 3,712 parts In-Stock

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3,712

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Vyrian

USA . 3,587 parts In-Stock

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3,587

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Anansix

USA . 1,078 parts In-Stock

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1,078

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Digiode

USA . 624 parts In-Stock

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624

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Cyclops Electronics Ltd

UK . 40 parts In-Stock

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40

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 635 parts In-Stock

1+ parts

$0.149

100+ parts

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$0.143

635

$0.149

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$0.143

Northwest PG Solutions

USA . 2,326 parts In-Stock

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$0.164

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$0.145

2,326

$0.164

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$0.145

One Stop Electronics

USA . 1,026 parts In-Stock

1+ parts

$25.000

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1,026

$25.000

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Corphita

USA . 4,280 parts In-Stock

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4,280

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UNI Independent Distributors

Spain . 4,035 parts In-Stock

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Authorized Procurement Solutions

USA . 3,712 parts In-Stock

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3,712

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Metaverse IC Inc.

Canada . 1,100 parts In-Stock

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1,100

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Technical Specifications

RF & Microwave Amplifiers CGD1046HI attributes and parameters. Explore more RF & Microwave Amplifiers devices from NXP Semiconductors

Specs

Additional Features:

LOW NOISE

Characteristic Impedance:

75 ohm

Construction:

MODULE

Gain:

26.5 dB

JESD-609 Code:

e4

Maximum Operating Frequency:

1003 MHz

Minimum Operating Frequency:

40 MHz

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-20 Cel

RF or Microwave Device Type:

Terminal Finish:

GOLD

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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