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CBTW28DD14ET

NXP Semiconductors

CBTW28DD14ET by NXP Semiconductors

CBTW28DD14ET by NXP Semiconductors is a CMOS multiplexer with 2 inputs, designed for surface mount applications. It operates b/w 1.4V and 2V, with a max temp of 85 °C. This compact grid array package features a thin profile and fine pitch design for efficient space utilization.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Chip Stock

USA . 66,880 parts In-Stock

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Cyclops Electronics Ltd

UK . 36,000 parts In-Stock

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Vyrian

USA . 3,754 parts In-Stock

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Quantum Digital Technology

USA . 3,201 parts In-Stock

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Digiode

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Anansix

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One Stop Electronics

USA . 1,167 parts In-Stock

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Native Components

USA . 175 parts In-Stock

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$746.390

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$731.462

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$723.998

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$716.534

175

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$731.462

$723.998

$716.534

Northwest PG Solutions

USA . 1,983 parts In-Stock

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Kepictronics

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A-Z Elektronik GmbH

Germany . 4,517 parts In-Stock

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Corphita

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Alle Elektronik GmbH

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Perfect Parts

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Authorized Procurement Solutions

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Overview

Transform your designs with the CBTW28DD14ET from NXP Semiconductors, a leader in innovative solutions. This high-quality multiplexer/demultiplexer combines reliability and efficiency in a compact square package, perfect for diverse applications from consumer electronics to automotive systems. With low power consumption and exceptional thermal performance, it ensures seamless operation, bringing unmatched value and benefits to your projects. Elevate your engineering with NXP’s trusted technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material contributes to a robust design, ensuring reliability in various applications.

Surface Mount: YES

Surface mount technology enables efficient use of board space, making it suitable for compact designs.

No. of Inputs: 2

Having 2 inputs offers flexibility and allows for simple multiplexing or demultiplexing tasks.

Package Shape: SQUARE

The square shape provides uniformity in layout, simplifying PCB design and assembly processes.

Nominal Supply Voltage / Vsup (V): 1.5

The nominal voltage ensures compatibility with low-power applications, enhancing energy efficiency.

No. of Terminals: 48

A higher number of terminals allows for more connections, providing versatility in circuit designs.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The fine pitch and thin profile allow for high-density installations, essential for modern electronic devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, it is suitable for a variety of environments without overheating.

Minimum Operating Temperature: -10 °C

A low minimum operating temperature makes it suitable for use in colder climates and varied conditions.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates efficient space utilization on PCBs and improves layout flexibility.

Maximum Seated Height: 1.1 mm

A low seated height allows for a slim profile, beneficial for height-constrained applications.

Width: 4.5 mm

The compact width aids in maintaining a small footprint which is crucial in space-sensitive designs.

Output Polarity: TRUE

True output polarity enhances functionality in various digital applications by ensuring consistent signal behavior.

Minimum Supply Voltage (Vsup): 1.4 V

A low minimum supply voltage allows compatibility with a wide range of power sources, enhancing application versatility.

Length: 4.5 mm

The compact length supports space-efficient designs, particularly useful in portable electronics.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for modern digital circuits.

Terminal Form: BALL

Ball terminals facilitate better soldering and reliability in surface-mount applications.

Packing Method: TR

Tape and reel packing simplifies handling and improves automation in manufacturing processes.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for high-density packaging while maintaining ease of solderability.

Maximum Supply Voltage (Vsup): 2 V

Supporting a maximum supply voltage of 2 V extends application possibilities while ensuring safety in operation.

Maximum Power Supply Current (ICC): 1 mA

A low maximum power supply current enhances energy efficiency, making it suitable for battery-powered devices.

Technical Specifications

Multiplexer & Demultiplexer CBTW28DD14ET attributes and parameters. Explore more Multiplexer & Demultiplexer devices from NXP Semiconductors

Specs

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

S-PBGA-B48

Length:

4.5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-10 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA48,8X8,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Packing Method:

TR

Maximum Power Supply Current (ICC):

1 mA

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

2 V

Minimum Supply Voltage (Vsup):

1.4 V

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

4.5 mm

Trade Compliance

CBTW28DD14ET Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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