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CBTS3253PW

NXP Semiconductors

CBTS3253PW by NXP Semiconductors

BUS EXCHANGER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,119 parts In-Stock

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Anansix

USA . 2,076 parts In-Stock

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Vyrian

USA . 360 parts In-Stock

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360

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Distributors (Availability)

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Native Components

USA . 92 parts In-Stock

1+ parts

$0.506

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Northwest PG Solutions

USA . 757 parts In-Stock

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$0.557

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$0.491

757

$0.557

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$0.491

Andel Nordic

Denmark . 1,111 parts In-Stock

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$20.630

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$14.442

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$14.442

1,111

$20.630

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$14.442

One Stop Electronics

USA . 1,541 parts In-Stock

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$21.000

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$21.000

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Ampacity Inc.

Singapore . 1,488 parts In-Stock

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$51.000

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$51.000

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A-Z Elektronik GmbH

Germany . 5,604 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,736 parts In-Stock

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Kepictronics

USA . 1,880 parts In-Stock

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Corphita

USA . 1,859 parts In-Stock

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UNI Independent Distributors

Spain . 1,059 parts In-Stock

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Perfect Parts

USA . 258 parts In-Stock

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Technical Specifications

Bus Driver & Transceivers CBTS3253PW attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Control Type:

ENABLE LOW

Count Direction:

BIDIRECTIONAL

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

2

No. of Inputs:

1

No. of Outputs:

4

No. of Ports:

5

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

.25 ns

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

CBTS3253PW Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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