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CBTL02043ABQ

NXP Semiconductors

CBTL02043ABQ by NXP Semiconductors

NXP Semiconductors' CBTL02043ABQ is a 4-bit bus driver with 3-state output, operating at -40 to 85°C. It has a supply voltage range of 3-3.6V and supports up to 50pF load capacitance. This chip carrier package is ideal for bidirectional communication in industrial applications.

Median Price

$1.406

Lifecycle Status

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10

In-Stock Inventory

1k+

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USA . 2,706 parts In-Stock

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Anansix

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AZTECH Wire

Italy . 433 parts In-Stock

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$14.090

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Ampacity Inc.

Singapore . 621 parts In-Stock

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Corohmni

South Africa . 710 parts In-Stock

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Aztec Data Supply Inc.

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Advanced Electronics

New Zealand . 100 parts In-Stock

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One Stop Electronics

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Overview

Discover the power of seamless connectivity with the NXP Semiconductors CBTL02043ABQ, a top-of-the-line bus driver and transceiver that offers unparalleled quality and reliability. Perfect for a wide range of applications, this innovative product delivers value by providing efficient data transmission and optimal performance. With advanced features and superior technology, customers can trust in the benefits and advantages that this chip carrier brings to their projects. Upgrade your systems today and experience the difference with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material helps to make the product lightweight and durable.

Surface Mount: YES

This feature allows for easy installation and saves space on the PCB.

No. of Bits: 4

The 4-bit design provides enough data transmission capabilities for most bus driver applications.

Nominal Supply Voltage (Vsup): 3.3V

Operating at a stable voltage of 3.3V ensures reliability and efficiency.

Load Capacitance (CL): 50 pF

Having a load capacitance of 50pF ensures smooth signal transmission without interference.

No. of Terminals: 20

The 20 terminals provide ample connectivity options for various external components.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can function reliably in a wide range of environments.

Output Characteristics: 3-STATE

The 3-state output allows for high flexibility and compatibility with different systems.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures functionality even in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance.

No. of Ports: 3

Having 3 ports allows for efficient data communication with multiple devices simultaneously.

Maximum Seated Height: 1mm

The low seated height of 1mm makes this product suitable for compact designs.

Width: 2.5mm

The narrow width of 2.5mm helps to save space on the PCB.

Output Polarity: TRUE

The true output polarity ensures accurate signal transmission.

Minimum Supply Voltage (Vsup): 3V

Operating at a minimum supply voltage of 3V ensures compatibility with various power sources.

Maximum Time At Peak Reflow Temperature: 30s

The product can withstand peak reflow temperatures for up to 30 seconds, making it suitable for reflow soldering.

Peak Reflow Temperature: 260 C

With a peak reflow temperature of 260°C, the product is suitable for high-temperature soldering processes.

Length: 4.5mm

The compact length of 4.5mm is ideal for space-constrained applications.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures reliable performance in harsh industrial environments.

Technology: CMOS

The CMOS technology used in the product offers low power consumption and high noise immunity.

Terminal Form: NO LEAD

The no-lead terminal form is environmentally friendly and compliant with RoHS regulations.

Packing Method: TR, 7 INCH

The tape and reel packing method provides convenient handling and storage for mass production.

Terminal Pitch: 0.5mm

The fine terminal pitch of 0.5mm enables high-density mounting on the PCB.

Count Direction: BIDIRECTIONAL

The bidirectional count direction allows for versatile data communication in both directions.

Maximum Supply Voltage (Vsup): 3.6V

The product can safely operate at a maximum supply voltage of 3.6V, providing an extra margin of safety.

Maximum Power Supply Current (ICC): 2.5mA

With a maximum power supply current of 2.5mA, the product is energy-efficient and suitable for low-power applications.

Technical Specifications

Bus Driver & Transceivers CBTL02043ABQ attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Count Direction:

BIDIRECTIONAL

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PQCC-N20

JESD-609 Code:

e4

Length:

4.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Ports:

3

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC20,.1X.18,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR, 7 INCH

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

2.5 mA

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.5 mm

Trade Compliance

CBTL02043ABQ Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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