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BUK9MJJ-65PLL,518

NXP Semiconductors

BUK9MJJ-65PLL,518 by NXP Semiconductors

BUK9MJJ-65PLL,518 from NXP Semiconductors is an N-channel power FET designed for enhancement mode applications. It supports a max drain current of 11.6 A and power dissipation of 4.4 W, operating up to 150 °C. Ideal for efficient switching in various electronic devices.

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Chip Stock

USA . 182,000 parts In-Stock

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Vyrian

USA . 3,267 parts In-Stock

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Digiode

USA . 3,146 parts In-Stock

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Anansix

USA . 1,574 parts In-Stock

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AZTECH Wire

Italy . 363 parts In-Stock

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$19.550

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One Stop Electronics

USA . 1,452 parts In-Stock

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$37.050

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QUARKTWIN TECHNOLOGY LTD

USA . 13,697 parts In-Stock

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Microchip USA

USA . 7,516 parts In-Stock

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UNI Independent Distributors

Spain . 4,638 parts In-Stock

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Corphita

USA . 3,838 parts In-Stock

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Northwest PG Solutions

USA . 1,964 parts In-Stock

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Native Components

USA . 454 parts In-Stock

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Robosynatics

Brazil . 300 parts In-Stock

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Lucentia Tech

USA . 300 parts In-Stock

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$1.750

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$1.620

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$1.620

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$1.620

Overview

Elevate your designs with the BUK9MJJ-65PLL,518 from NXP Semiconductors—a powerhouse in the realm of Power FETs. Crafted with precision and reliability, this N-channel transistor excels in high-performance applications where efficiency matters. With its robust capabilities and exceptional thermal management, it ensures longevity and consistent performance, empowering your electronics to reach new heights while simplifying assembly with its surface mount design. Choose NXP for quality you can trust!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-resistance and higher conductivity, making them ideal for applications requiring efficient power management.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient manufacturing processes, making this FET suitable for modern electronic devices.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation ensures that the FET only conducts when a positive gate voltage is applied, improving control and efficiency in power applications.

Maximum Drain Current (Abs): 11.6 A

With a high maximum drain current, this FET can handle significant load currents, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 4.4 W

A power dissipation rating of 4.4 W indicates that this FET can operate effectively without overheating, enhancing reliability in power circuits.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for higher input impedance and faster switching speeds, making it ideal for a variety of power electronics applications.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C enables the FET to be used in demanding environments without performance degradation.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that proper handling and storage are necessary, but it also means that this device can be manufactured with good reliability in standard environments.

Maximum Time At Peak Reflow Temperature (s): 30

The allowance for a peak reflow time of 30 seconds ensures compatibility with high temperature soldering processes, enhancing the versatility of this FET in assembly.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C indicates that the FET can withstand typical reflow soldering processes, ensuring durability and reliability in final products.

Technical Specifications

Power Field Effect Transistors (FET) BUK9MJJ-65PLL,518 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Maximum Drain Current (Abs) (ID):

11.6 A

Maximum Drain Current (ID):

11.6 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Moisture Sensitivity Level (MSL):

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

BUK9MJJ-65PLL,518 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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