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BUK954R4-40B,127

NXP Semiconductors

BUK954R4-40B,127 by NXP Semiconductors

NXP Semiconductors' BUK954R4-40B,127 is a N-channel Power FET with 40V DS breakdown voltage and 697A pulsed drain current. Ideal for switching applications, it features a built-in diode, 0.0044 ohm max on-resistance, and 961mJ avalanche energy rating.

Median Price

$1.292

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 2,000 parts In-Stock

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$1.220

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$1.090

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$1.020

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$1.220

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$1.020

Verical

USA . 2,000 parts In-Stock

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$1.363

10k+ parts

$1.275

2,000

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$1.363

$1.275

Distributors (In-Stock)

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Digiode

USA . 573 parts In-Stock

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$0.658

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Vyrian

USA . 2,658 parts In-Stock

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Anansix

USA . 2,312 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 4,729 parts In-Stock

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$0.624

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Microchip USA

USA . 565 parts In-Stock

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$4.680

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565

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AZTECH Wire

Italy . 912 parts In-Stock

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$18.170

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$18.170

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QUARKTWIN TECHNOLOGY LTD

USA . 29,860 parts In-Stock

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UNI Independent Distributors

Spain . 2,271 parts In-Stock

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Continental Prestige Electronics

USA . 2,000 parts In-Stock

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$0.830

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$0.830

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Northwest PG Solutions

USA . 1,284 parts In-Stock

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Native Components

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Overview

Unlock the power of NXP Semiconductors with the BUK954R4-40B,127 Power Field Effect Transistor. This single N-channel transistor with a built-in diode is perfect for switching applications, offering a minimum DS breakdown voltage of 40V and maximum drain current of 75A. With a high power dissipation of 254W and an avalanche energy rating of 961mJ, this transistor provides reliable performance in demanding environments. Trust NXP Semiconductors for quality components that deliver exceptional value and benefits to customers across a range of industries.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making the product reliable and long-lasting.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have better performance and efficiency compared to P-Channel FETs, making this product a good choice for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier circuit design and can protect against reverse voltage, enhancing the functionality of the product.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can handle high currents and voltages effectively.

Minimum DS Breakdown Voltage: 40 V

With a high breakdown voltage, this FET can handle higher voltage loads with ease, making it suitable for a wide range of applications.

Maximum Power Dissipation (Abs): 254 W

The high power dissipation rating allows the FET to handle large amounts of power without overheating, ensuring reliable operation.

Maximum Operating Temperature: 175 °C

The high operating temperature range allows the FET to operate in various environments and applications without performance degradation.

Maximum Drain-Source On Resistance: 0.0044 ohm

With a low on-resistance, this FET can minimize power losses and improve efficiency in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) BUK954R4-40B,127 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Avalanche Energy Rating (EAS):

961 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

75 A

Maximum Drain Current (ID):

75 A

Maximum Drain-Source On Resistance:

.0044 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

697 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BUK954R4-40B,127 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.75

SB

8541.29.00.80

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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