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BUK763R4-30B,118

NXP Semiconductors

BUK763R4-30B,118 by NXP Semiconductors

BUK763R4-30B,118 by NXP Semiconductors is a powerful N-channel FET designed for high-efficiency applications. It supports a max drain current of 75 A and power dissipation of 255 W, operating up to 175 °C. Ideal for enhancing performance in various electronic circuits.

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Lifecycle Status

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5

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1k+

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Chip Stock

USA . 175,000 parts In-Stock

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Vyrian

USA . 6,557 parts In-Stock

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Digiode

USA . 2,977 parts In-Stock

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Anansix

USA . 2,373 parts In-Stock

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Bristol Electronics

USA . 204 parts In-Stock

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AZTECH Wire

Italy . 638 parts In-Stock

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$18.790

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One Stop Electronics

USA . 1,421 parts In-Stock

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Component Stockers USA

USA . 278 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 24,574 parts In-Stock

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UNI Independent Distributors

Spain . 5,537 parts In-Stock

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Microchip USA

USA . 2,587 parts In-Stock

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Northwest PG Solutions

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Native Components

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Corphita

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iodParts Technologies Inc.

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Overview

Unlock unmatched performance with the BUK763R4-30B,118 from NXP Semiconductors, a leader in cutting-edge technology. This high-quality N-channel Power FET is designed to deliver superior efficiency and reliability for demanding applications, such as automotive and industrial systems. With enhanced temperature resilience and robust power handling, experience peace of mind knowing you have a component that excels under pressure, empowering your innovations every step of the way.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-resistance and higher efficiency, making them suitable for high-speed switching applications.

Configuration: SINGLE

Single configuration simplifies circuit design and minimizes space, allowing for easier integration into compact applications.

Surface Mount: YES

Surface mount technology enables a smaller footprint, allowing for flexible PCB designs and improved manufacturability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides better control and higher efficiency in switching applications, reducing power loss.

Maximum Drain Current (Abs): 75 A

With a maximum drain current of 75 A, this FET can handle high power requirements, making it suitable for demanding applications.

Maximum Power Dissipation (Abs): 255 W

A high power dissipation capability of 255 W allows for stable operation under heavy loads, enhancing reliability and longevity.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology results in high input impedance and fast switching speeds, making it ideal for high-frequency applications.

Maximum Operating Temperature: 175 °C

Operating at a maximum temperature of 175 °C ensures reliability in high-temperature environments, expanding application range.

Terminal Finish: TIN

The tin terminal finish aids in solderability, ensuring strong and reliable connections during assembly and operation.

Maximum Time At Peak Reflow Temperature (s): 30

A peak reflow time of 30 seconds allows for compatibility with various assembly processes while minimizing thermal stress.

Peak Reflow Temperature °C: 245

A peak reflow temperature of 245 °C is suitable for most soldering techniques, ensuring robust assembly without damaging the component.

Technical Specifications

Power Field Effect Transistors (FET) BUK763R4-30B,118 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

75 A

Maximum Drain Current (ID):

75 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

BUK763R4-30B,118 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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