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BLF3G22-30,135

NXP Semiconductors

BLF3G22-30,135 by NXP Semiconductors

BLF3G22-30,135 by NXP Semiconductors is an N-channel enhancement mode FET ideal for high-efficiency power applications. It supports a max drain current of 12 A and operates up to 150 °C, making it suitable for demanding environments. This transistor excels in RF amplification and switching applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,528 parts In-Stock

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3,528

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Anansix

USA . 1,833 parts In-Stock

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Digiode

USA . 1,332 parts In-Stock

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1,332

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AZTECH Wire

Italy . 530 parts In-Stock

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$12.960

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530

$12.960

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One Stop Electronics

USA . 1,628 parts In-Stock

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$17.050

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1,628

$17.050

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Northwest PG Solutions

USA . 2,102 parts In-Stock

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UNI Independent Distributors

Spain . 1,082 parts In-Stock

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Corphita

USA . 1,033 parts In-Stock

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Native Components

USA . 534 parts In-Stock

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Overview

Elevate your designs with the BLF3G22-30,135 N-channel FET from NXP Semiconductors, a leader in innovation and quality. This high-performance transistor ensures efficient power management for a range of applications, from automotive to industrial systems. With superior thermal stability and robust reliability, you’ll enjoy enhanced performance and longevity in your projects, making it the ideal choice for engineers seeking excellence.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically provide better performance in terms of switching speeds and lower on-resistance, making them a preferred choice for power applications.

Configuration: SINGLE

Single configuration simplifies the design and reduces space in electronic circuits, making it suitable for compact applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer low off-state current and high input impedance, which enhances overall efficiency in circuits.

Maximum Drain Current (Abs): 12 A

A high maximum drain current of 12 A allows this FET to handle significant power loads, making it ideal for various high-current applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides excellent scalability and strong electrical characteristics, making it a reliable choice for modern electronic designs.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C allows for reliable performance in demanding environments, ensuring durability and stability.

Technical Specifications

Power Field Effect Transistors (FET) BLF3G22-30,135 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

12 A

Maximum Drain Current (ID):

12 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Sub-Category:

FET General Purpose Power

Trade Compliance

BLF3G22-30,135 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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