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BLF245,112

NXP Semiconductors

BLF245,112 by NXP Semiconductors

NXP Semiconductors BLF245,112 is an N-CHANNEL RF Power FET with 65V DS Breakdown Voltage and 13dB Power Gain. Ideal for amplifier applications in the VHF band, it features a max power dissipation of 68W and operates in enhancement mode at up to 200°C.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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VNN

France . 5,920 parts In-Stock

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Vyrian

USA . 5,818 parts In-Stock

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Digiode

USA . 1,034 parts In-Stock

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Anansix

USA . 358 parts In-Stock

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Nova Conductors

Japan . 32 parts In-Stock

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One Stop Electronics

USA . 1,126 parts In-Stock

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$12.050

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AZTECH Wire

Italy . 330 parts In-Stock

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Ampacity Inc.

Singapore . 659 parts In-Stock

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$37.050

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UNI Independent Distributors

Spain . 5,173 parts In-Stock

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Corphita

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Bastille Electronics

Australia . 18 parts In-Stock

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Overview

Enhance your amplifier applications with the BLF245,112 by NXP Semiconductors, a top-quality RF Power Field Effect Transistor. With a ceramic, metal-sealed package and impressive power gain of 13 dB, this N-CHANNEL transistor offers reliable performance in the VERY HIGH FREQUENCY BAND. Delivering a maximum power dissipation of 68 W, this single configuration transistor is perfect for high-power amplification needs. Trust NXP Semiconductors for cutting-edge technology and superior products that provide value and efficiency to customers.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Provides excellent thermal conductivity and mechanical strength, ensuring reliable operation in high-power applications.

Minimum Power Gain (Gp): 13 dB

High power gain indicates efficient amplification of signals, making this FET suitable for applications requiring strong signal amplification.

Highest Frequency Band: VERY HIGH FREQUENCY BAND

Capable of operating in very high frequency bands, allowing for use in applications requiring high-speed signal processing.

Maximum Power Dissipation (Abs): 68 W

Can dissipate high levels of power without overheating, making it suitable for high-power applications.

Maximum Operating Temperature: 200 °C

Capable of operating at high temperatures without performance degradation, suitable for demanding environments.

Technical Specifications

RF Power Field Effect Transistors (FET) BLF245,112 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

LOW NOISE

Case Connection:

ISOLATED

Configuration:

Minimum DS Breakdown Voltage:

65 V

Maximum Drain Current (Abs) (ID):

6 A

Maximum Drain Current (ID):

6 A

Maximum Drain-Source On Resistance:

.75 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

VERY HIGH FREQUENCY BAND

JESD-30 Code:

O-CRFM-F4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

ROUND

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

68 W

Maximum Power Dissipation (Abs):

Minimum Power Gain (Gp):

13 dB

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

FLAT

Terminal Position:

RADIAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

BLF245,112 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.75

SB

8541.29.00.80

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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