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BGY88

NXP Semiconductors

BGY88 by NXP Semiconductors

WIDE BAND HIGH POWER; Gain: 35 dB; Characteristic Impedance: 75 ohm; Construction: MODULE; Additional Features: LOW NOISE; Minimum Operating Temperature: -20 Cel;

Median Price

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Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

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Digiode

USA . 4,545 parts In-Stock

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Anansix

USA . 1,319 parts In-Stock

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Vyrian

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GES GmbH

Germany . 48 parts In-Stock

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Digital Electronic Gebert Verwaltungs UG

Germany . 25 parts In-Stock

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Manotoh

Italy . 11 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 8 parts In-Stock

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Pegasus Components GmbH

Germany . 5 parts In-Stock

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ACDS - Activité Composants Distribution Service

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Halfin

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Donberg Electronics Ltd

Ireland . 1 parts In-Stock

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Resion

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Q Components

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Native Components

USA . 304 parts In-Stock

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Northwest PG Solutions

USA . 2,047 parts In-Stock

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$1.044

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One Stop Electronics

USA . 1,625 parts In-Stock

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UNI Independent Distributors

Spain . 7,830 parts In-Stock

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Corphita

USA . 2,567 parts In-Stock

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GreenTree Electronics

Israel . 163 parts In-Stock

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Assy Fe

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Technical Specifications

RF & Microwave Amplifiers BGY88 attributes and parameters. Explore more RF & Microwave Amplifiers devices from NXP Semiconductors

Specs

Additional Features:

LOW NOISE

Characteristic Impedance:

75 ohm

Construction:

MODULE

Gain:

35 dB

Maximum Operating Frequency:

450 MHz

Minimum Operating Frequency:

40 MHz

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-20 Cel

RF or Microwave Device Type:

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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