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ADC1613D125HN/C1,5

NXP Semiconductors

ADC1613D125HN/C1,5 by NXP Semiconductors

ADC1613D125HN/C1,5 by NXP is a 16-bit A/D converter with a max linearity error of just 0.0076%. It operates b/w -40 °C to 85 °C and supports power supplies of 1.8V and 3V. Ideal for industrial applications requiring precise analog-to-digital conversion.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,725 parts In-Stock

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4,725

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Digiode

USA . 1,445 parts In-Stock

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Anansix

USA . 760 parts In-Stock

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760

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One Stop Electronics

USA . 1,117 parts In-Stock

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$5.000

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$5.000

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Advanced Electronics

New Zealand . 30 parts In-Stock

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$6.346

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$5.775

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$5.204

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30

$6.346

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$5.204

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Native Components

USA . 55 parts In-Stock

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$7.540

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55

$7.540

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Microchip USA

USA . 3,136 parts In-Stock

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$9.543

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3,136

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AZTECH Wire

Italy . 57 parts In-Stock

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$17.110

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57

$17.110

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Corohmni

South Africa . 450 parts In-Stock

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$19.865

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Component Stockers USA

USA . 449 parts In-Stock

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$99.990

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449

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UNI Independent Distributors

Spain . 6,972 parts In-Stock

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Corphita

USA . 4,956 parts In-Stock

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Northwest PG Solutions

USA . 153 parts In-Stock

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Overview

Unlock unparalleled performance with the ADC1613D125HN/C1,5 from NXP Semiconductors, a leader in innovative technologies. This advanced analog-to-digital converter delivers exceptional accuracy and reliability, ensuring your designs stand out in demanding applications. With its compact, surface-mount package and robust temperature range, it's ideal for industrial automation, robotics, and more. Elevate your projects with a solution that combines quality, efficiency, and unmatched support from a trusted manufacturer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package material ensures durability and protection against environmental factors, making it reliable for various applications.

Surface Mount: YES

Being a surface mount device allows for easier integration into compact PCB designs, enhancing space efficiency in electronic assemblies.

No. of Functions: 2

Having two functions allows for versatility in applications, potentially reducing the number of components needed in a circuit.

Package Shape: SQUARE

The square package shape allows for efficient layout and routing on printed circuit boards, optimizing space and performance.

No. of Bits: 16

With 16 bits of resolution, this ADC provides high precision and detail in signal representation, making it suitable for demanding applications.

Maximum Linearity Error (EL): 0.0076%

A low maximum linearity error enhances accuracy and reliability in digital output, crucial for high-performance signal processing.

Power Supplies (V): 1.8, 3

Support for dual power supply options (1.8V and 3V) increases system flexibility and compatibility with various electronic designs.

No. of Terminals: 56

The inclusion of 56 terminals offers extensive connectivity options, facilitating integration into complex systems.

Package Style (Meter): CHIP CARRIER

The chip carrier style package provides enhanced thermal and electrical performance, making it ideal for industrial applications.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures (up to 85 °C) makes this ADC suitable for use in harsh environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product is ideal for use in extreme conditions, ensuring reliability across diverse applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, ensuring long-lasting connections in electronic circuits.

Terminal Position: QUAD

Quad terminal position contributes to efficient layout and minimizes signal interference, enhancing overall performance.

Temperature Grade: INDUSTRIAL

An industrial temperature grade signifies robustness and reliability for critical applications, ensuring performance over a wide temperature range.

Maximum Analog Input Voltage: 3.4 V

The maximum analog input voltage of 3.4 V allows for a broader range of input signals without risking damage to the device.

Terminal Form: NO LEAD

A no-lead terminal form simplifies integration and reduces the footprint, making it more efficient for modern compact designs.

Converter Type: A/D CONVERTER

As an Analog-to-Digital Converter, this product is essential for applications requiring accurate digital representation of analog signals.

Output Bit Code: OFFSET BINARY

Outputting in offset binary format ensures easy compatibility with many digital systems, streamlining data processing.

Terminal Pitch: 0.5 mm

A small terminal pitch of 0.5 mm allows for more compact designs and higher-density mounting, ideal for advanced electronic applications.

Technical Specifications

Analog-to-Digital Converters ADC1613D125HN/C1,5 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

2

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary

Maximum Linearity Error (EL):

0.0076 %

Electrical Specifications

Power Supplies:

1.8,3 V

Maximum Analog Input Voltage:

3.4 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

56

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC56,.31SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N56

Qualified:

No

JESD-609 Code:

e3

Trade Compliance

ADC1613D125HN/C1,5 Converters trade compliance attributes, and parameters.

ECCN

3A001.A.5.A.5

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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