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ADC1113S125HN/C1,5

NXP Semiconductors

ADC1113S125HN/C1,5 by NXP Semiconductors

ADC1113S125HN/C1,5 by NXP is an 11-bit A/D converter with a max linearity error of 0.24% and operates b/w -40 °C to 85 °C. It features a compact chip carrier package with 32 terminals and supports power supplies of 1.8V and 3V. Ideal for industrial applications requiring precise analog-to-digital conversion.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 7,257 parts In-Stock

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Anansix

USA . 1,896 parts In-Stock

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Digiode

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Native Components

USA . 77 parts In-Stock

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$0.791

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Northwest PG Solutions

USA . 1,932 parts In-Stock

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$0.871

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Corohmni

South Africa . 770 parts In-Stock

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One Stop Electronics

USA . 726 parts In-Stock

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$15.000

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AZTECH Wire

Italy . 293 parts In-Stock

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$19.290

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Aztec Data Supply Inc.

USA . 500 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 15,706 parts In-Stock

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Microchip USA

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Corphita

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UNI Independent Distributors

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Overview

Unlock unparalleled performance with the ADC1113S125HN/C1,5 from NXP Semiconductors, a leader in cutting-edge technology. Designed for precision and reliability, this 11-bit Analog-to-Digital Converter excels in demanding industrial applications, ensuring your systems operate flawlessly across a wide temperature range. Experience enhanced accuracy, reduced errors, and seamless integration, making it the ideal choice for your next innovative project. Embrace quality that drives results!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures longevity and protection against environmental factors, making this ADC suitable for various applications.

Surface Mount: YES

Being surface mount compatible allows for a compact design and easy integration into modern electronic circuits.

Package Shape: SQUARE

The square package shape helps in efficient space utilization on PCB layouts, optimizing design and assembly processes.

No. of Bits: 11

With 11 bits of resolution, this ADC provides high accuracy and precision for a variety of applications, enhancing data quality.

Maximum Linearity Error (EL): 0.24%

A maximum linearity error of 0.24% indicates excellent linearity performance, ensuring reliable and accurate signal conversion.

Power Supplies (V): 1.8, 3

Dual supply voltages (1.8V and 3V) provide flexibility in integration with different systems, catering to low-power designs.

No. of Terminals: 32

The 32 terminals facilitate extensive connectivity options, enabling versatile applications across various device configurations.

Package Style (Meter): CHIP CARRIER

The chip carrier package style supports efficient heat dissipation, enhancing the performance and reliability of the ADC.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature makes this device suitable for industrial applications where temperature extremes may occur.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this ADC can function in harsh and cold environments, ensuring consistent performance.

Terminal Finish: MATTE TIN

The matte tin terminal finish improves solderability and provides robust protection against corrosion, enhancing the longevity of the product.

Terminal Position: QUAD

Quad terminal positioning allows for more standardized PCB designs, simplifying the layout process for engineers.

Temperature Grade: INDUSTRIAL

The industrial temperature grade means the ADC is designed to operate reliably in demanding conditions, making it ideal for industrial usage.

Maximum Analog Input Voltage: 2 V

A maximum analog input voltage of 2V ensures compatibility with a wide range of sensors and signal sources, broadening its application scope.

Terminal Form: NO LEAD

The no-lead terminal form enhances the device's footprint on PCBs, allowing for more compact designs and reduced assembly costs.

Converter Type: A/D CONVERTER

As an Analog-to-Digital Converter, this device is essential for converting real-world analog signals into digital form, crucial for data processing applications.

Output Bit Code: OFFSET BINARY

The offset binary output coding is commonly used in digital systems, simplifying integration with processors and improving overall system compatibility.

Terminal Pitch: 0.635 mm

A terminal pitch of 0.635 mm allows for high-density layouts on PCBs, accommodating complex designs while maintaining reliability.

Technical Specifications

Analog-to-Digital Converters ADC1113S125HN/C1,5 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

11

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary

Maximum Linearity Error (EL):

0.24 %

Electrical Specifications

Power Supplies:

1.8,3 V

Maximum Analog Input Voltage:

2 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

32

Terminal Form:

Terminal Pitch:

0.025 in (0.635 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC32,.27SQ,25

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N32

Qualified:

No

JESD-609 Code:

e3

Trade Compliance

ADC1113S125HN/C1,5 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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