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A3M37TL039T2

NXP Semiconductors

A3M37TL039T2 by NXP Semiconductors

NARROW BAND HIGH POWER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 26; Package Body Material: PLASTIC/EPOXY; Technology: LDMOS; Construction: COMPONENT;

Median Price

$33.550

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

RFMW

USA . 2,000 parts In-Stock

1+ parts

$28.740

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

$28.740

-

-

-

Richardson RFPD

USA . 2 parts In-Stock

1+ parts

$32.570

100+ parts

$29.310

1k+ parts

-

10k+ parts

-

2

$32.570

$29.310

-

-

Chip1Stop

Japan . 2 parts In-Stock

1+ parts

$47.700

100+ parts

-

1k+ parts

-

10k+ parts

-

2

$47.700

-

-

-

Rochester

USA . 23,355 parts In-Stock

1+ parts

-

100+ parts

$35.200

1k+ parts

$31.490

10k+ parts

$29.640

23,355

-

$35.200

$31.490

$29.640

Verical

USA . 2 parts In-Stock

1+ parts

-

100+ parts

$33.550

1k+ parts

$33.550

10k+ parts

$33.550

2

-

$33.550

$33.550

$33.550

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,472 parts In-Stock

1+ parts

$26.543

100+ parts

-

1k+ parts

-

10k+ parts

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2,472

$26.543

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-

-

Martec Srl

Italy . 244,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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244,000

-

-

-

-

Flip Electronics

USA . 23,750 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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23,750

-

-

-

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Vyrian

USA . 2,999 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,999

-

-

-

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Anansix

USA . 1,652 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,652

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 669 parts In-Stock

1+ parts

$1.140

100+ parts

-

1k+ parts

-

10k+ parts

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669

$1.140

-

-

-

Northwest PG Solutions

USA . 741 parts In-Stock

1+ parts

$1.254

100+ parts

-

1k+ parts

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10k+ parts

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741

$1.254

-

-

-

AZTECH Wire

Italy . 177 parts In-Stock

1+ parts

$15.810

100+ parts

-

1k+ parts

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10k+ parts

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177

$15.810

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Corphita

USA . 3,893 parts In-Stock

1+ parts

$25.146

100+ parts

-

1k+ parts

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10k+ parts

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3,893

$25.146

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UNI Independent Distributors

Spain . 6,290 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,290

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Technical Specifications

RF & Microwave Amplifiers A3M37TL039T2 attributes and parameters. Explore more RF & Microwave Amplifiers devices from NXP Semiconductors

Specs

Additional Features:

I/P POWER-MAX (PEAK)=25DBM

Characteristic Impedance:

50 ohm

Construction:

COMPONENT

Gain:

26.1 dB

JESD-609 Code:

e4

Mounting Feature:

No. of Functions:

1

No. of Terminals:

26

Maximum Operating Frequency:

3800 MHz

Minimum Operating Frequency:

3600 MHz

Maximum Operating Temperature:

125 Cel

Package Body Material:

Package Equivalence Code:

LCC26,.24X.4,40

Power Supplies (V):

26

RF or Microwave Device Type:

Technology:

Terminal Finish:

NICKEL PALLADIUM GOLD

Trade Compliance

A3M37TL039T2 RF & Microwave trade compliance attributes, and parameters.

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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