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935311653147

NXP Semiconductors

935311653147 by NXP Semiconductors

WIDE BAND MEDIUM POWER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 3; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Maximum Supply Current: 104 mA;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,090 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,090

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Digiode

USA . 2,348 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,348

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Anansix

USA . 1,731 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1,731

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,215 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1,215

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Technical Specifications

RF & Microwave Amplifiers 935311653147 attributes and parameters. Explore more RF & Microwave Amplifiers devices from NXP Semiconductors

Specs

Characteristic Impedance:

50 ohm

Construction:

COMPONENT

Gain:

18.4 dB

Maximum Input Power (CW):

23 dBm

Mounting Feature:

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Frequency:

3800 MHz

Minimum Operating Frequency:

450 MHz

Package Body Material:

Package Equivalence Code:

TO-243

Power Supplies (V):

5

RF or Microwave Device Type:

Maximum Supply Current:

104 mA

Technology:

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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