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74LVT543PW,112

NXP Semiconductors

74LVT543PW,112 by NXP Semiconductors

REGISTERED BUS TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: TSSOP; Package Shape: RECTANGULAR;

Median Price

$1.620

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 185 parts In-Stock

1+ parts

-

100+ parts

$1.620

1k+ parts

$1.450

10k+ parts

$1.360

185

-

$1.620

$1.450

$1.360

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,087 parts In-Stock

1+ parts

$0.874

100+ parts

-

1k+ parts

-

10k+ parts

-

2,087

$0.874

-

-

-

Vyrian

USA . 2,176 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,176

-

-

-

-

Anansix

USA . 1,117 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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1,117

-

-

-

-

LIBRA Elektronik GmbH

Germany . 45 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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-

45

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,057 parts In-Stock

1+ parts

$0.828

100+ parts

-

1k+ parts

-

10k+ parts

-

2,057

$0.828

-

-

-

Andel Nordic

Denmark . 1,991 parts In-Stock

1+ parts

$8.836

100+ parts

-

1k+ parts

$8.482

10k+ parts

$8.482

1,991

$8.836

-

$8.482

$8.482

AZTECH Wire

Italy . 1,140 parts In-Stock

1+ parts

$20.530

100+ parts

-

1k+ parts

-

10k+ parts

-

1,140

$20.530

-

-

-

Native Components

USA . 848 parts In-Stock

1+ parts

$24.755

100+ parts

-

1k+ parts

-

10k+ parts

-

848

$24.755

-

-

-

Northwest PG Solutions

USA . 1,681 parts In-Stock

1+ parts

$27.230

100+ parts

$24.507

1k+ parts

-

10k+ parts

-

1,681

$27.230

$24.507

-

-

Microchip USA

USA . 333 parts In-Stock

1+ parts

$39.860

100+ parts

-

1k+ parts

-

10k+ parts

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333

$39.860

-

-

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UNI Independent Distributors

Spain . 4,893 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,893

-

-

-

-

Technical Specifications

Bus Driver & Transceivers 74LVT543PW,112 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVT

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4.7 ns

Propagation Delay (tpd):

7.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

4.4 mm

Trade Compliance

74LVT543PW,112 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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