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74LVCH32373AEC,518

NXP Semiconductors

74LVCH32373AEC,518 by NXP Semiconductors

BUS DRIVER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 96; Package Code: LFBGA; Package Shape: RECTANGULAR;

Median Price

$9.304

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 658 parts In-Stock

1+ parts

-

100+ parts

$8.270

1k+ parts

$7.400

10k+ parts

$6.960

658

-

$8.270

$7.400

$6.960

Verical

USA . 658 parts In-Stock

1+ parts

-

100+ parts

$10.338

1k+ parts

$9.250

10k+ parts

$8.700

658

-

$10.338

$9.250

$8.700

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,792 parts In-Stock

1+ parts

$4.484

100+ parts

-

1k+ parts

-

10k+ parts

-

1,792

$4.484

-

-

-

Vyrian

USA . 2,436 parts In-Stock

1+ parts

-

100+ parts

-

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2,436

-

-

-

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Anansix

USA . 329 parts In-Stock

1+ parts

-

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-

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-

329

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,124 parts In-Stock

1+ parts

$4.248

100+ parts

-

1k+ parts

-

10k+ parts

-

2,124

$4.248

-

-

-

Andel Nordic

Denmark . 5,216 parts In-Stock

1+ parts

$4.899

100+ parts

-

1k+ parts

$4.703

10k+ parts

$4.703

5,216

$4.899

-

$4.703

$4.703

AZTECH Wire

Italy . 614 parts In-Stock

1+ parts

$11.440

100+ parts

-

1k+ parts

-

10k+ parts

-

614

$11.440

-

-

-

Microchip USA

USA . 470 parts In-Stock

1+ parts

$15.209

100+ parts

-

1k+ parts

-

10k+ parts

-

470

$15.209

-

-

-

UNI Independent Distributors

Spain . 3,069 parts In-Stock

1+ parts

-

100+ parts

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3,069

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-

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Northwest PG Solutions

USA . 753 parts In-Stock

1+ parts

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753

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Native Components

USA . 52 parts In-Stock

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52

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Technical Specifications

Bus Driver & Transceivers 74LVCH32373AEC,518 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PBGA-B96

JESD-609 Code:

e0

Length:

13.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

4

No. of Bits:

8

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

96

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,6X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

5.9 ns

Propagation Delay (tpd):

5.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.5 mm

Trade Compliance

74LVCH32373AEC,518 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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