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74LVCH32244AEC,557

NXP Semiconductors

74LVCH32244AEC,557 by NXP Semiconductors

NXP Semiconductors' 74LVCH32244AEC,557 is an 8-bit bus driver with a propagation delay of 4.5 ns at 3.3V supply voltage. It features a low profile grid array package and operates in industrial temperature range (-40 to 85°C). Ideal for applications requiring fast signal transmission and efficient power consumption.

Median Price

$6.986

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7,125 parts In-Stock

1+ parts

-

100+ parts

$6.210

1k+ parts

$5.560

10k+ parts

$5.230

7,125

-

$6.210

$5.560

$5.230

Verical

USA . 4,275 parts In-Stock

1+ parts

-

100+ parts

$7.763

1k+ parts

$6.950

10k+ parts

$6.537

4,275

-

$7.763

$6.950

$6.537

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,283 parts In-Stock

1+ parts

$3.363

100+ parts

-

1k+ parts

-

10k+ parts

-

3,283

$3.363

-

-

-

Bristol Electronics

USA . 921 parts In-Stock

1+ parts

$5.600

100+ parts

$2.426

1k+ parts

$2.296

10k+ parts

-

921

$5.600

$2.426

$2.296

-

Vyrian

USA . 6,618 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,618

-

-

-

-

Anansix

USA . 2,416 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,416

-

-

-

-

Dan-Mar Components

USA . 921 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

921

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 5 parts In-Stock

1+ parts

$0.031

100+ parts

-

1k+ parts

-

10k+ parts

$0.030

5

$0.031

-

-

$0.030

Ampacity Inc.

Singapore . 5,638 parts In-Stock

1+ parts

$3.010

100+ parts

-

1k+ parts

-

10k+ parts

-

5,638

$3.010

-

-

-

Corphita

USA . 4,650 parts In-Stock

1+ parts

$3.186

100+ parts

-

1k+ parts

-

10k+ parts

-

4,650

$3.186

-

-

-

Andel Nordic

Denmark . 923 parts In-Stock

1+ parts

$3.240

100+ parts

-

1k+ parts

$3.111

10k+ parts

$3.111

923

$3.240

-

$3.111

$3.111

Microchip USA

USA . 352 parts In-Stock

1+ parts

$19.750

100+ parts

$19.750

1k+ parts

$19.750

10k+ parts

$19.750

352

$19.750

$19.750

$19.750

$19.750

AZTECH Wire

Italy . 460 parts In-Stock

1+ parts

$20.340

100+ parts

-

1k+ parts

-

10k+ parts

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460

$20.340

-

-

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Continental Prestige Electronics

USA . 7,125 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,125

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UNI Independent Distributors

Spain . 2,697 parts In-Stock

1+ parts

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2,697

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Northwest PG Solutions

USA . 2,360 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,360

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-

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Overview

Looking for a reliable and high-performance bus driver & transceiver to enhance your electronic designs? Look no further than the 74LVCH32244AEC,557 by NXP Semiconductors. With NXP's reputation for quality and innovation, this product offers seamless integration, fast propagation delay, and versatile applications. From industrial automation to automotive systems, this component provides value, efficiency, and reliability that will exceed your expectations. Upgrade your projects with the best in the industry and experience the difference with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability for long-term use.

Propagation Delay At Nominal Supply: 4.5 ns

Low propagation delay ensures fast data transmission and response times.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into electronic systems.

No. of Functions: 8

Ability to perform multiple functions provides versatility and efficiency in bus driver applications.

Package Shape: RECTANGULAR

Rectangular package shape allows for compact and space-saving design.

Nominal Supply Voltage / Vsup (V): 2.7

Low supply voltage requirement helps in reducing power consumption.

Power Supplies (V): 3.3

Stable power supply voltage ensures consistent performance of the bus driver & transceivers.

No. of Terminals: 96

Sufficient number of terminals for connectivity and signal transmission in complex systems.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array package style with low profile and fine pitch enables high-density mounting and space efficiency.

Maximum I (ol): 24 Amp

High output current capability allows for driving multiple loads with ease.

Propagation Delay (tpd): 4.7 ns

Low propagation delay ensures fast and efficient data transmission.

Maximum Operating Temperature: 85 °C

Wide operating temperature range makes it suitable for industrial applications.

Output Characteristics: 3-STATE

3-state output allows for flexible control of the output signal.

Minimum Operating Temperature: -40 °C

Operational at low temperatures ensures reliability in harsh environments.

Terminal Finish: Tin/Lead (Sn63Pb37)

Tin/Lead terminal finish provides good solderability and mechanical strength.

No. of Ports: 2

Multiple ports enable connection to multiple devices for data exchange.

Maximum Seated Height: 1.5 mm

Low seated height allows for compact and slim designs.

Width: 5.5 mm

Narrow width contributes to space-saving and efficient PCB layout.

Output Polarity: TRUE

True output polarity ensures correct signal transmission.

Minimum Supply Voltage (Vsup): 1.2 V

Low minimum supply voltage requirement minimizes power consumption.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for sufficient time for reflow soldering process during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability ensures reliable soldering connections.

Length: 13.5 mm

Compact length for space-efficient placement on PCB.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance for reliable operation in demanding environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal form enables easy and reliable solder connections.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for high-density mounting on PCBs.

Control Type: ENABLE LOW

Enable Low control type for easy interfacing with control signals.

Moisture Sensitivity Level (MSL): 4

Moisture sensitivity level 4 indicates the device can withstand standard reflow soldering processes.

Maximum Supply Voltage (Vsup): 3.6 V

High maximum supply voltage tolerance for flexibility in power supply configurations.

Technical Specifications

Bus Driver & Transceivers 74LVCH32244AEC,557 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Control Type:

ENABLE LOW

Family:

LVC/LCX/Z

JESD-30 Code:

R-PBGA-B96

JESD-609 Code:

e0

Length:

13.5 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

4

No. of Bits:

4

No. of Functions:

8

No. of Ports:

2

No. of Terminals:

96

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,6X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4.5 ns

Propagation Delay (tpd):

4.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn63Pb37)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.5 mm

Trade Compliance

74LVCH32244AEC,557 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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