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74LVC16245ABQ,518

NXP Semiconductors

74LVC16245ABQ,518 by NXP Semiconductors

74LVC16245ABQ,518 from NXP is a CMOS bus driver with an 8-bit capacity and a propagation delay of just 6 ns. It operates at a nominal voltage of 3.3V and supports bidirectional data flow. Ideal for automotive applications, it features robust thermal performance with a max temp of 125 °C.

Median Price

$1.448

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

$1.420

1k+ parts

$1.180

10k+ parts

$1.050

5,000

-

$1.420

$1.180

$1.050

Verical

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.475

10k+ parts

$1.313

5,000

-

-

$1.475

$1.313

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 957 parts In-Stock

1+ parts

$0.566

100+ parts

-

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957

$0.566

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Vyrian

USA . 5,944 parts In-Stock

1+ parts

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5,944

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Anansix

USA . 544 parts In-Stock

1+ parts

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544

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 52 parts In-Stock

1+ parts

$0.170

100+ parts

-

1k+ parts

-

10k+ parts

$0.163

52

$0.170

-

-

$0.163

Northwest PG Solutions

USA . 410 parts In-Stock

1+ parts

$0.187

100+ parts

-

1k+ parts

-

10k+ parts

$0.165

410

$0.187

-

-

$0.165

Corphita

USA . 2,528 parts In-Stock

1+ parts

$0.536

100+ parts

-

1k+ parts

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2,528

$0.536

-

-

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Andel Nordic

Denmark . 2,724 parts In-Stock

1+ parts

$5.958

100+ parts

-

1k+ parts

$5.719

10k+ parts

$5.719

2,724

$5.958

-

$5.719

$5.719

Microchip USA

USA . 280 parts In-Stock

1+ parts

$8.868

100+ parts

-

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280

$8.868

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AZTECH Wire

Italy . 351 parts In-Stock

1+ parts

$11.780

100+ parts

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351

$11.780

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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100+ parts

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10,000

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UNI Independent Distributors

Spain . 7,621 parts In-Stock

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7,621

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Overview

Unlock unparalleled performance with the 74LVC16245ABQ from NXP Semiconductors. Renowned for its quality and reliability, this bus driver & transceiver excels in diverse applications, from automotive to industrial automation. Experience exceptional speed and efficiency, with a remarkable propagation delay of just 6 ns. Trust in NXP’s commitment to innovation and durability, ensuring your projects run smoothly and effectively. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and reliability, making it suitable for various applications.

Propagation Delay At Nominal Supply: 6 ns

A low propagation delay ensures fast signal transmission, enhancing overall system performance.

Surface Mount: YES

Surface mount technology allows for efficient use of space on the PCB, accommodating compact designs.

No. of Functions: 2

Having two functions increases versatility, enabling more complex circuit designs with fewer components.

No. of Bits: 8

An 8-bit configuration supports a wide range of data transfer applications, improving data handling capabilities.

Nominal Supply Voltage / Vsup: 3.3 V

Operating at a nominal voltage of 3.3 V is ideal for low-power applications, helping to reduce overall power consumption.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF indicates good performance at lower capacitance values, which can lead to faster switching times.

Power Supplies (V): 3.3 V

Compatibility with standard 3.3 V power supplies makes integration easy in modern digital circuits.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging types are conducive to robust connections and facilitate better heat dissipation.

Maximum I (ol): 24 Amp

With a high output current capability of 24 Amps, this product can drive significant loads, making it suitable for high-performance applications.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C ensures reliable performance in high-heat environments, suitable for automotive and industrial applications.

Output Characteristics: 3-STATE

3-state output characteristics allow for efficient bus communication in multi-device environments, enhancing data flow management.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C ensures reliable functionality in extreme cold environments, making it ideal for automotive applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent corrosion resistance and ensures reliable electrical connections over time.

Terminal Position: QUAD

Quad terminal configurations facilitate better circuit layout options, allowing for more compact designs.

Output Polarity: TRUE

True output polarity helps simplify circuit designs and increase compatibility with various digital devices.

Maximum Time At Peak Reflow Temperature: 30 s

A maximum peak reflow time of 30 seconds ensures compatibility with standard soldering processes, which is vital for efficient manufacturing.

Peak Reflow Temperature: 260 °C

A peak reflow temperature of 260 °C ensures component durability during assembly, reducing the risk of damage.

Temperature Grade: AUTOMOTIVE

An automotive temperature grade signifies robust performance and reliability, meeting strict industry standards.

Technology: CMOS

CMOS technology offers low power consumption and high speed, which is essential for modern electronic applications.

Terminal Form: NO LEAD

No lead terminal forms reduce board space and minimize solder joint issues, enhancing assembly efficiency.

Packing Method: TR

Tape and reel packing enhances automated assembly processes, optimizing production efficiency.

Count Direction: BIDIRECTIONAL

Bidirectional count capability allows for greater flexibility in data communication and processing.

Control Type: COMMON CONTROL

Common control type enables simplified circuit design, enhancing usability across various applications.

Moisture Sensitivity Level (MSL): 2

An MSL of 2 indicates moderate moisture sensitivity, allowing for standard handling procedures during manufacturing.

Technical Specifications

Bus Driver & Transceivers 74LVC16245ABQ,518 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

JESD-609 Code:

e4

Load Capacitance (CL):

50 pF

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

2

No. of Bits:

8

No. of Functions:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC(UNSPEC)

Package Style (Meter):

CHIP CARRIER

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6 ns

Qualification:

Not Qualified

Sub-Category:

Bus Driver/Transceivers

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

74LVC16245ABQ,518 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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