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74HCT11N,652

NXP Semiconductors

74HCT11N,652 by NXP Semiconductors

NXP Semiconductors' 74HCT11N,652 is a CMOS Logic Gate with 3 functions and inputs. It operates at a supply voltage of 5V, has a propagation delay of 30ns, and can handle a load capacitance of 50pF. Widely used in automotive applications due to its temperature grade and through-hole terminal form.

Median Price

$0.708

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10,077 parts In-Stock

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-

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$0.695

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$0.577

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$0.514

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$0.695

$0.577

$0.514

Verical

USA . 4,182 parts In-Stock

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$0.721

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$0.643

4,182

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$0.721

$0.643

Distributors (In-Stock)

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Digiode

USA . 2,835 parts In-Stock

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$0.277

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Vyrian

USA . 3,674 parts In-Stock

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Anansix

USA . 2,158 parts In-Stock

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Rebound Electronics

UK . 8 parts In-Stock

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Corphita

USA . 3,209 parts In-Stock

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$0.263

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$0.263

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Component Stockers USA

USA . 45,204 parts In-Stock

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$0.300

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$0.280

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$0.250

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$0.250

45,204

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$0.250

Microchip USA

USA . 238 parts In-Stock

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$0.415

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238

$0.415

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AZTECH Wire

Italy . 397 parts In-Stock

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$20.040

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UNI Independent Distributors

Spain . 8,185 parts In-Stock

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Perfect Parts

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Native Components

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Northwest PG Solutions

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Overview

Power up your projects with the 74HCT11N,652 logic gate from NXP Semiconductors! This high-quality component offers unmatched reliability and performance for a wide range of applications. With three functions and three inputs, this rectangular-shaped package is perfect for automotive projects and more. Experience fast propagation delay and a wide operating temperature range, making it ideal for demanding environments. Trust NXP Semiconductors to deliver the best in logic gates – choose the 74HCT11N,652 for your next project and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material ensures durability and protection for the internal components of the logic gates, making it a reliable choice for long-term use.

Propagation Delay At Nominal Supply: 30 ns

The low propagation delay ensures fast response time, making this product suitable for applications where speed is critical.

No. of Functions: 3

Having multiple functions in one chip provides versatility and saves space on the circuit board, making the product efficient and cost-effective.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes integration with other components easier, ensuring compatibility in most applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature makes the logic gates suitable for use in various environments, including automotive applications that may experience high temperatures.

Technical Specifications

Logic Gates 74HCT11N,652 attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

HCT

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e4

Length:

19.025 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

3

No. of Inputs:

3

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

30 ns

Propagation Delay (tpd):

36 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

4.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

74HCT11N,652 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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