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74HC640DB,112

NXP Semiconductors

74HC640DB,112 by NXP Semiconductors

BUS TRANSCEIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SSOP; Package Shape: RECTANGULAR;

Median Price

$0.876

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 35 parts In-Stock

1+ parts

-

100+ parts

$0.876

1k+ parts

$0.727

10k+ parts

$0.648

35

-

$0.876

$0.727

$0.648

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,732 parts In-Stock

1+ parts

$0.350

100+ parts

-

1k+ parts

-

10k+ parts

-

3,732

$0.350

-

-

-

Vyrian

USA . 5,026 parts In-Stock

1+ parts

-

100+ parts

-

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5,026

-

-

-

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Anansix

USA . 673 parts In-Stock

1+ parts

-

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-

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673

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,823 parts In-Stock

1+ parts

$0.331

100+ parts

-

1k+ parts

-

10k+ parts

-

2,823

$0.331

-

-

-

Component Stockers USA

USA . 887 parts In-Stock

1+ parts

$0.380

100+ parts

$0.360

1k+ parts

-

10k+ parts

-

887

$0.380

$0.360

-

-

Andel Nordic

Denmark . 1,936 parts In-Stock

1+ parts

$0.924

100+ parts

-

1k+ parts

$0.887

10k+ parts

$0.887

1,936

$0.924

-

$0.887

$0.887

Microchip USA

USA . 238 parts In-Stock

1+ parts

$7.242

100+ parts

-

1k+ parts

-

10k+ parts

-

238

$7.242

-

-

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AZTECH Wire

Italy . 995 parts In-Stock

1+ parts

$19.320

100+ parts

-

1k+ parts

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10k+ parts

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995

$19.320

-

-

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UNI Independent Distributors

Spain . 3,475 parts In-Stock

1+ parts

-

100+ parts

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3,475

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Northwest PG Solutions

USA . 1,901 parts In-Stock

1+ parts

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1,901

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Native Components

USA . 777 parts In-Stock

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777

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Technical Specifications

Bus Driver & Transceivers 74HC640DB,112 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

7.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

27 ns

Propagation Delay (tpd):

27 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Translation:

N/A

Width:

5.3 mm

Trade Compliance

74HC640DB,112 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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