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74HC3G06DP,125

NXP Semiconductors

74HC3G06DP,125 by NXP Semiconductors

INVERTER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;

Median Price

$0.298

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,746 parts In-Stock

1+ parts

-

100+ parts

$0.309

1k+ parts

$0.257

10k+ parts

$0.229

2,746

-

$0.309

$0.257

$0.229

Verical

USA . 2,646 parts In-Stock

1+ parts

-

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-

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10k+ parts

$0.286

2,646

-

-

-

$0.286

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,465 parts In-Stock

1+ parts

$0.124

100+ parts

-

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2,465

$0.124

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Chip Stock

USA . 172,000 parts In-Stock

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172,000

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Vyrian

USA . 2,417 parts In-Stock

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2,417

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Anansix

USA . 529 parts In-Stock

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529

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Distributors (Availability)

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Corphita

USA . 1,434 parts In-Stock

1+ parts

$0.117

100+ parts

-

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1,434

$0.117

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Microchip USA

USA . 273 parts In-Stock

1+ parts

$0.910

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273

$0.910

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AZTECH Wire

Italy . 1,162 parts In-Stock

1+ parts

$11.800

100+ parts

-

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1,162

$11.800

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Corohmni

South Africa . 647 parts In-Stock

1+ parts

$32.736

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647

$32.736

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$36.037

100+ parts

$32.794

1k+ parts

$29.550

10k+ parts

-

1,000

$36.037

$32.794

$29.550

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UNI Independent Distributors

Spain . 5,437 parts In-Stock

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5,437

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Northwest PG Solutions

USA . 1,100 parts In-Stock

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1,100

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Native Components

USA . 166 parts In-Stock

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166

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Technical Specifications

Logic Gates 74HC3G06DP,125 attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

HC/UH

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Inputs:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

25 ns

Propagation Delay (tpd):

125 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

74HC3G06DP,125 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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