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74HC32BQ-Q100,115

NXP Semiconductors

74HC32BQ-Q100,115 by NXP Semiconductors

NXP Semiconductors' 74HC32BQ-Q100,115 is a CMOS logic gate with 4 functions and 2 inputs. It has a propagation delay of 27 ns at 5V supply voltage, suitable for automotive applications due to AEC-Q100 screening. The chip carrier package style with very thin profile makes it ideal for space-constrained designs.

Median Price

$0.340

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,000 parts In-Stock

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$0.130

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$0.122

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$0.110

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$0.130

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DigiKey

USA . 24,000 parts In-Stock

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$0.340

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$0.181

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$0.152

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$0.340

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Mouser Electronics

USA . 20,273 parts In-Stock

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$0.340

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$0.182

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$0.153

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$0.139

20,273

$0.340

$0.182

$0.153

$0.139

Distributors (In-Stock)

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Digiode

USA . 137 parts In-Stock

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$0.124

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$0.124

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Nova Conductors

Japan . 1,000 parts In-Stock

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$0.209

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Chip Stock

USA . 164,000 parts In-Stock

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VNN

France . 5,918 parts In-Stock

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RLX Solution Inc.

Canada . 3,000 parts In-Stock

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Vyrian

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Anansix

USA . 702 parts In-Stock

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Ampacity Inc.

Singapore . 7,912 parts In-Stock

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$0.111

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Corphita

USA . 1,748 parts In-Stock

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Argo Parts USA

USA . 4,473 parts In-Stock

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$0.203

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Continental Prestige Electronics

USA . 1,826 parts In-Stock

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$0.205

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Netroflash

USA . 500 parts In-Stock

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Semicontronic

India . 15,326 parts In-Stock

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$0.241

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AZTECH Wire

Italy . 2,524 parts In-Stock

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Microchip USA

USA . 5,102 parts In-Stock

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Corohmni

South Africa . 514 parts In-Stock

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$21.421

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Aztec Data Supply Inc.

USA . 2,652 parts In-Stock

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$32.670

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UNI Independent Distributors

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Supply Digital

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Overview

Enhance your automotive applications with the high-quality 74HC32BQ-Q100,115 logic gates by NXP Semiconductors. Designed for reliability and performance, these logic gates offer fast propagation delays and low power consumption, making them ideal for a wide range of automotive electronics. With AEC-Q100 screening and CMOS technology, these logic gates provide dependable operation in extreme temperatures. Trust NXP Semiconductors to deliver cutting-edge solutions for your automotive needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making this product suitable for various environments.

Propagation Delay At Nominal Supply: 27 ns

Fast propagation delay allows for quick signal processing, making this product efficient for time-sensitive applications.

Surface Mount: YES

Ease of installation and replacement, suitable for modern electronics manufacturing processes.

No. of Functions: 4

Offers versatility and flexibility in circuit design, allowing for multiple logic operations in a single component.

Screening Level: AEC-Q100

Meets automotive electronic component reliability standards, ensuring high performance in harsh automotive environments.

Package Shape: RECTANGULAR

Compact design for efficient use of space on a circuit board.

Nominal Supply Voltage / Vsup (V): 5

Compatible with common supply voltages, making integration into existing circuits easier.

Load Capacitance (CL): 50 pF

Suitable for driving standard loads without performance degradation.

Power Supplies (V): 2/6

Compatible with a wide range of power supplies, offering flexibility in system integration.

No. of Terminals: 14

Sufficient number of terminals for connecting to other components in a circuit.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Various package styles to suit different application requirements and circuit board layouts.

Maximum I (ol): 4 Amp

Capable of driving higher current loads, suitable for demanding applications.

Propagation Delay (tpd): 135 ns

Acceptable propagation delay for most applications, balancing speed and power consumption.

Maximum Operating Temperature: 125 °C

Can operate reliably in elevated temperature environments, suitable for industrial or automotive applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for use in cold environments without performance issues.

Terminal Position: QUAD

Quad terminal layout for easy connection to other components, simplifying circuit design.

Maximum Seated Height: 1 mm

Low profile design for space-constrained applications.

Width: 2.5 mm

Compact width for efficient use of space on a circuit board.

Minimum Supply Voltage (Vsup): 2 V

Low minimum supply voltage for energy-efficient operation.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient time for reflow soldering during manufacturing without damaging the component.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance for reliable soldering during manufacturing processes.

Length: 3 mm

Compact length for efficient use of space on a circuit board.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards, ensuring reliability in automotive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable operation.

Terminal Form: NO LEAD

Lead-free terminal form for environmental compliance and long-term reliability.

Packing Method: TR

Tape and reel packing for easy handling and automated assembly in manufacturing processes.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density mounting on a circuit board.

Maximum Supply Voltage (Vsup): 6 V

High maximum supply voltage tolerance for compatibility with a wide range of power sources.

Technical Specifications

Logic Gates 74HC32BQ-Q100,115 attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

HC/UH

JESD-30 Code:

R-PQCC-N14

Length:

3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC14,.1X.12,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

27 ns

Propagation Delay (tpd):

135 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.5 mm

Trade Compliance

74HC32BQ-Q100,115 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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