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74HC243N,652

NXP Semiconductors

74HC243N,652 by NXP Semiconductors

BUS TRANSCEIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;

Median Price

$0.438

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 30 parts In-Stock

1+ parts

-

100+ parts

$0.438

1k+ parts

$0.363

10k+ parts

$0.324

30

-

$0.438

$0.363

$0.324

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,982 parts In-Stock

1+ parts

$0.175

100+ parts

-

1k+ parts

-

10k+ parts

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2,982

$0.175

-

-

-

Vyrian

USA . 3,780 parts In-Stock

1+ parts

-

100+ parts

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3,780

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-

-

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Anansix

USA . 2,680 parts In-Stock

1+ parts

-

100+ parts

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2,680

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,136 parts In-Stock

1+ parts

$0.166

100+ parts

-

1k+ parts

-

10k+ parts

-

4,136

$0.166

-

-

-

Component Stockers USA

USA . 18 parts In-Stock

1+ parts

$0.190

100+ parts

-

1k+ parts

-

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18

$0.190

-

-

-

Andel Nordic

Denmark . 2,689 parts In-Stock

1+ parts

$11.308

100+ parts

-

1k+ parts

$10.856

10k+ parts

$10.856

2,689

$11.308

-

$10.856

$10.856

AZTECH Wire

Italy . 559 parts In-Stock

1+ parts

$16.470

100+ parts

-

1k+ parts

-

10k+ parts

-

559

$16.470

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 8,172 parts In-Stock

1+ parts

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8,172

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Microchip USA

USA . 6,073 parts In-Stock

1+ parts

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6,073

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UNI Independent Distributors

Spain . 4,494 parts In-Stock

1+ parts

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4,494

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-

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Northwest PG Solutions

USA . 1,601 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$4.142

10k+ parts

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1,601

-

-

$4.142

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Native Components

USA . 595 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$4.100

10k+ parts

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595

-

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$4.100

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Perfect Parts

USA . 183 parts In-Stock

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183

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Technical Specifications

Bus Driver & Transceivers 74HC243N,652 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

HC/UH

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e4

Length:

19.025 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

4

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

27 ns

Propagation Delay (tpd):

135 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Translation:

N/A

Width:

7.62 mm

Trade Compliance

74HC243N,652 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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