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74AVCH16T245BQ,518

NXP Semiconductors

74AVCH16T245BQ,518 by NXP Semiconductors

74AVCH16T245BQ,518 from NXP is a CMOS bus driver with a propagation delay of just 10.2 ns and supports bidirectional data transfer at 0.8/3.3V levels. It features a compact no-lead package and operates in extreme temperatures from -40 °C to 125 °C, ideal for automotive applications. With a load capacitance of only 15 pF, it ensures efficient signal integrity in high-speed environments.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 5,363 parts In-Stock

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Digiode

USA . 4,826 parts In-Stock

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Anansix

USA . 532 parts In-Stock

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Native Components

USA . 413 parts In-Stock

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Northwest PG Solutions

USA . 1,606 parts In-Stock

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Andel Nordic

Denmark . 1,609 parts In-Stock

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AZTECH Wire

Italy . 825 parts In-Stock

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Microchip USA

USA . 150 parts In-Stock

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One Stop Electronics

USA . 1,008 parts In-Stock

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UNI Independent Distributors

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Corphita

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Overview

Unlock unparalleled performance with the 74AVCH16T245BQ,518 from NXP Semiconductors! This robust bus driver and transceiver excels in reliability and efficiency, making it ideal for automotive applications. Experience the ease of bidirectional data translation and superior temperature resilience that ensures your designs run seamlessly. Trust in NXP's commitment to quality and innovation, bringing you exceptional value and performance in every circuit.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable packaging material ensures reliability and protection for the device, making it suitable for various applications.

Propagation Delay At Nominal Supply: 10.2 ns

A low propagation delay contributes to faster signal transmission, enhancing performance in high-speed applications.

Surface Mount: YES

The surface mount capability allows for compact designs and efficient space utilization on printed circuit boards.

No. of Functions: 2

Having multiple functions in a single package allows for more versatile designs and reduces component count.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient placement and organization on circuit boards, facilitating better layout designs.

No. of Bits: 8

With 8 bits, this device can handle a substantial amount of data, making it suitable for various digital applications.

Translation: 0.8/3.3V&0.8/3.3V

This dual voltage translation capability enhances compatibility with different logic levels, simplifying integration into existing systems.

Load Capacitance (CL): 15 pF

A low load capacitance ensures rapid switching and minimized signal degradation, ideal for high-speed digital signals.

Power Supplies (V): 1.2/3.3

The ability to operate on low power supplies makes this device energy-efficient, reducing overall power consumption.

No. of Terminals: 60

Having 60 terminals provides extensive connectivity options for diverse applications, enhancing its versatility.

Package Style (Meter): GRID ARRAY

The grid array style promotes effective thermal management and reliable connection to PCB, ensuring stable operation.

Maximum I (ol): 6 Amp

A high output current capability supports a wide range of applications, accommodating devices that require significant power.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product is capable of functioning in challenging environments, increasing reliability.

Output Characteristics: 3-STATE

The 3-state output allows for greater flexibility in circuit design, enabling multiple drivers to share a bus without conflict.

Minimum Operating Temperature: -40 °C

A low minimum operating temperature ensures functionality in extreme cold environments, making it suitable for automotive applications.

Terminal Position: BOTTOM

Bottom terminal positioning can facilitate better PCB layout options and more efficient signal routing.

Output Polarity: TRUE

True output polarity provides significant design clarity and predictability, ensuring consistent circuit behavior.

Temperature Grade: AUTOMOTIVE

This device meets automotive grade specifications, making it a reliable choice for automotive applications where durability is paramount.

Technology: CMOS

Using CMOS technology ensures lower power consumption and higher noise immunity, making it suitable for modern electronic devices.

Terminal Form: NO LEAD

No lead terminals contribute to better environmental compatibility and reduce potential soldering issues, enhancing reliability.

Packing Method: TR

The tape and reel packing method allows for automated assembly processes, optimizing manufacturing efficiency.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for high-density layouts, maximizing space on PCB while ensuring proper connectivity.

Count Direction: BIDIRECTIONAL

Bidirectional counting capability enhances the functionality in data transmission, allowing for more flexible designs.

Control Type: COMMON CONTROL

Common control simplifies design and integration, allowing for easier control of multiple functions within a single device.

Technical Specifications

Bus Driver & Transceivers 74AVCH16T245BQ,518 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

JESD-30 Code:

R-PBGA-N60

Load Capacitance (CL):

15 pF

Maximum I (ol):

6 Amp

No. of Bits:

8

No. of Functions:

2

No. of Terminals:

60

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

LGA

Package Equivalence Code:

LGA60,8X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY

Packing Method:

TR

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

10.2 ns

Qualification:

Not Qualified

Sub-Category:

Bus Driver/Transceivers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Translation:

0.8/3.3V&0.8/3.3V

Trade Compliance

74AVCH16T245BQ,518 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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