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74ALVT162241DL,112

NXP Semiconductors

74ALVT162241DL,112 by NXP Semiconductors

NXP Semiconductors' 74ALVT162241DL,112 is a Bus Driver & Transceiver with 3 ns Propagation Delay. It has 4 functions, operates at 2.5V/3.3V, and features a 3-STATE output with series resistor. Ideal for industrial applications requiring fast signal transmission in compact designs.

Median Price

$3.960

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,581 parts In-Stock

1+ parts

-

100+ parts

$3.520

1k+ parts

$3.150

10k+ parts

$2.960

1,581

-

$3.520

$3.150

$2.960

Verical

USA . 1,581 parts In-Stock

1+ parts

-

100+ parts

$4.400

1k+ parts

$3.938

10k+ parts

$3.700

1,581

-

$4.400

$3.938

$3.700

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,030 parts In-Stock

1+ parts

$1.919

100+ parts

-

1k+ parts

-

10k+ parts

-

1,030

$1.919

-

-

-

Vyrian

USA . 5,566 parts In-Stock

1+ parts

-

100+ parts

-

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5,566

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Anansix

USA . 2,138 parts In-Stock

1+ parts

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2,138

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Distributors (Availability)

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Corphita

USA . 760 parts In-Stock

1+ parts

$1.818

100+ parts

-

1k+ parts

-

10k+ parts

-

760

$1.818

-

-

-

Andel Nordic

Denmark . 203 parts In-Stock

1+ parts

$6.140

100+ parts

-

1k+ parts

$4.297

10k+ parts

$4.297

203

$6.140

-

$4.297

$4.297

Microchip USA

USA . 118 parts In-Stock

1+ parts

$12.420

100+ parts

$12.420

1k+ parts

$12.420

10k+ parts

$12.420

118

$12.420

$12.420

$12.420

$12.420

AZTECH Wire

Italy . 1,208 parts In-Stock

1+ parts

$17.930

100+ parts

-

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10k+ parts

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1,208

$17.930

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QUARKTWIN TECHNOLOGY LTD

USA . 22,868 parts In-Stock

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UNI Independent Distributors

Spain . 7,824 parts In-Stock

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7,824

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Northwest PG Solutions

USA . 1,967 parts In-Stock

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1,967

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Continental Prestige Electronics

USA . 1,581 parts In-Stock

1+ parts

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100+ parts

$2.420

1k+ parts

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1,581

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$2.420

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Native Components

USA . 857 parts In-Stock

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857

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Overview

Experience unparalleled quality and reliability with the 74ALVT162241DL,112 by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors delivers top-notch Bus Driver & Transceivers like no other. This versatile product is perfect for a wide range of applications, offering customers seamless connectivity and optimal performance. Trust in NXP Semiconductors to provide you with the value, benefits, and advantages you need to take your projects to the next level. Elevate your designs with the 74ALVT162241DL,112 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where weight is a concern.

Propagation Delay At Nominal Supply: 3 ns

The low propagation delay ensures fast and efficient operation of the bus driver, making it suitable for high-speed communication systems.

Surface Mount: YES

Being surface mountable enables easy and efficient PCB assembly, saving time and effort during manufacturing.

No. of Functions: 4

With 4 functions integrated into one component, this bus driver offers compact and space-saving design solutions for applications with limited space.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at a low nominal supply voltage of 2.5V makes this bus driver energy-efficient and suitable for battery-powered devices.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

The 3-state output with series resistor feature allows for efficient control of the output signal, improving signal integrity and reducing noise.

Technology: BICMOS

Utilizing BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high speed, low power consumption, and high noise immunity.

Technical Specifications

Bus Driver & Transceivers 74ALVT162241DL,112 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

OUTPUT ENABLE ACTIVE HIGH FOR TWO FUNCTIONS

Control Type:

ENABLE LOW/HIGH

Family:

ALVT

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

15.875 mm

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP48,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Propagation Delay At Nominal Supply:

3 ns

Propagation Delay (tpd):

3.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.8 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

74ALVT162241DL,112 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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