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74ALVC164245BQ,518

NXP Semiconductors

74ALVC164245BQ,518 by NXP Semiconductors

74ALVC164245BQ,518 from NXP is a CMOS bus driver & transceiver with 8 bits and bidirectional control. It features a fast propagation delay of 7.5 ns, operates at both 3.3V & 5V, and supports automotive applications with a max temp of 125 °C. Ideal for efficient signal translation in compact designs.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 6,029 parts In-Stock

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Anansix

USA . 1,476 parts In-Stock

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Digiode

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Northwest PG Solutions

USA . 2,009 parts In-Stock

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Andel Nordic

Denmark . 3,043 parts In-Stock

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$4.878

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AZTECH Wire

Italy . 991 parts In-Stock

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One Stop Electronics

USA . 455 parts In-Stock

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Microchip USA

USA . 484 parts In-Stock

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$35.518

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Ampacity Inc.

Singapore . 743 parts In-Stock

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Corphita

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UNI Independent Distributors

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Native Components

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Overview

Elevate your designs with the 74ALVC164245BQ,518 from NXP Semiconductors—your go-to solution for reliable bus driving and transceiving. Crafted with precision, this high-quality device excels in automotive applications, providing seamless 3V and 5V translation with minimal delay. With robust performance in extreme temperatures, it ensures durability and efficiency in demanding environments. Choose NXP for innovation that drives success and unlocks unparalleled advantages in your projects!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective materials ensure reliability in various applications.

Propagation Delay At Nominal Supply: 7.5 ns

Low propagation delay contributes to high-speed data transmission, making it suitable for fast applications.

Surface Mount: YES

Supports modern manufacturing techniques for efficient assembly and space-saving designs.

No. of Functions: 2

Versatility in function allows for efficient circuit design and reduced components.

No. of Bits: 8

8-bit capability provides sufficient data handling for a wide range of applications.

Translation: 3V & 5V

Dual voltage compatibility enhances integration with various systems and components.

Load Capacitance (CL): 50 pF

Optimal load capacitance ensures stable performance in typical operational conditions.

Power Supplies (V): 3.3, 5

Wide power supply options allow flexibility in design and compatibility with existing systems.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging facilitates efficient mounting and enhances thermal and electrical performance.

Maximum I (ol): 24 Amp

High output current capability supports demanding applications, making it suitable for a variety of uses.

Maximum Operating Temperature: 125 °C

High-temperature operation ensures reliability in challenging environments and automotive applications.

Output Characteristics: 3-STATE

3-state output allows for flexible signal management, essential for bus systems.

Minimum Operating Temperature: -40 °C

Designed for extreme temperatures, making it ideal for outdoor and harsh conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Premium terminal finish enhances connectivity and improves long-term durability against corrosion.

Terminal Position: QUAD

Quad terminal configuration optimizes layout and connectivity options in applications.

Output Polarity: TRUE

True output polarity ensures predictable performance in logic applications.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for effective soldering processes without compromising component integrity.

Peak Reflow Temperature °C: 260

Supports high-temperature manufacturing processes, suitable for advanced electronics.

Temperature Grade: AUTOMOTIVE

Automotive grade certification indicates reliability for automotive applications.

Technology: CMOS

CMOS technology allows for low power consumption while maintaining high speed and performance.

Terminal Form: NO LEAD

No-lead design minimizes the size footprint and enhances thermal performance.

Packing Method: TR

Tape and reel packaging ensures ease of handling and efficient production processes.

Count Direction: BIDIRECTIONAL

Bidirectional capability allows for greater flexibility in data communication and control.

Control Type: COMMON CONTROL

Common control simplifies integration into systems, reducing complexity in design.

Moisture Sensitivity Level (MSL): 2

Moderate moisture sensitivity level indicates suitability for typical handling and assembly processes.

Technical Specifications

Bus Driver & Transceivers 74ALVC164245BQ,518 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

JESD-609 Code:

e4

Load Capacitance (CL):

50 pF

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

2

No. of Bits:

8

No. of Functions:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC(UNSPEC)

Package Style (Meter):

CHIP CARRIER

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,5

Propagation Delay At Nominal Supply:

7.5 ns

Qualification:

Not Qualified

Sub-Category:

Bus Driver/Transceivers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

3V & 5V

Trade Compliance

74ALVC164245BQ,518 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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