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74ABT00DB,118

NXP Semiconductors

74ABT00DB,118 by NXP Semiconductors

NAND GATE; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SSOP; Package Shape: RECTANGULAR;

Median Price

$1.172

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,990 parts In-Stock

1+ parts

-

100+ parts

$1.150

1k+ parts

$0.955

10k+ parts

$0.851

1,990

-

$1.150

$0.955

$0.851

Verical

USA . 1,990 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.193

10k+ parts

$1.064

1,990

-

-

$1.193

$1.064

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,861 parts In-Stock

1+ parts

$0.461

100+ parts

-

1k+ parts

-

10k+ parts

-

1,861

$0.461

-

-

-

Chip Stock

USA . 83,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

83,000

-

-

-

-

Vyrian

USA . 6,613 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,613

-

-

-

-

Anansix

USA . 2,483 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,483

-

-

-

-

DigiKey Marketplace

USA . 1,990 parts In-Stock

1+ parts

-

100+ parts

$0.500

1k+ parts

-

10k+ parts

-

1,990

-

$0.500

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,125 parts In-Stock

1+ parts

$0.436

100+ parts

-

1k+ parts

-

10k+ parts

-

3,125

$0.436

-

-

-

AZTECH Wire

Italy . 12,577 parts In-Stock

1+ parts

$0.670

100+ parts

-

1k+ parts

-

10k+ parts

-

12,577

$0.670

-

-

-

Microchip USA

USA . 233 parts In-Stock

1+ parts

$3.250

100+ parts

$3.230

1k+ parts

$3.220

10k+ parts

$3.210

233

$3.250

$3.230

$3.220

$3.210

Native Components

USA . 1,390 parts In-Stock

1+ parts

$59.950

100+ parts

-

1k+ parts

-

10k+ parts

$57.552

1,390

$59.950

-

-

$57.552

Northwest PG Solutions

USA . 2,245 parts In-Stock

1+ parts

$65.945

100+ parts

-

1k+ parts

-

10k+ parts

-

2,245

$65.945

-

-

-

UNI Independent Distributors

Spain . 3,626 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,626

-

-

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-

Continental Prestige Electronics

USA . 1,990 parts In-Stock

1+ parts

-

100+ parts

$0.580

1k+ parts

-

10k+ parts

-

1,990

-

$0.580

-

-

Supply Digital

USA . 612 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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612

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Technical Specifications

Logic Gates 74ABT00DB,118 attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

ABT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

6.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

20 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.05 mA

Propagation Delay At Nominal Supply:

4.1 ns

Propagation Delay (tpd):

3.4 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

74ABT00DB,118 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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